Display Device

ABSTRACT

To provide a display device that is suitable for increasing in size. To provide a display device in which display unevenness is suppressed. To provide a display device that can display an image along a curved surface. The display device includes two display panels, two plates, two stages, two driver circuits, two adjusting units, and a frame. Each display panel includes a display portion, an operating circuit portion, a terminal, an external electrode, a transparent portion, and a first portion and has flexibility. Each transparent portion includes a region transmitting visible light. The display panels are fixed so that transparent portions and parts of the display portions extend beyond the plates. The display portion of one of the two display panels overlaps with the transparent portion of the other display panel.

This application is a continuation of copending U.S. application Ser.No. 14/876,238, filed on Oct. 6, 2015 which is incorporated herein byreference.

TECHNICAL FIELD

One embodiment of the present invention relates to a display device.

Note that one embodiment of the present invention is not limited to theabove technical field. The technical field of one embodiment of theinvention disclosed in this specification and the like relates to anobject, a method, or a manufacturing method. In addition, one embodimentof the present invention relates to a process, a machine, manufacture,or a composition of matter. Specifically, examples of the technicalfield of one embodiment of the present invention disclosed in thisspecification include a semiconductor device, a display device, alight-emitting device, a lighting device, a power storage device, aninput device, a method for driving any of them, and a method formanufacturing any of them.

BACKGROUND ART

In recent years, larger display devices have been required. For example,a television device for home use (also referred to as a TV or atelevision receiver), digital signage, and a public information display(PID) are given. Larger digital signage, PID, and the like can providethe increased amount of information, and attract more attention whenused for advertisement or the like, so that the effectiveness of theadvertisement is expected to be increased.

Examples of the display device include, typically, a light-emittingdevice including a light-emitting element such as an organicelectroluminescent (EL) element or a light-emitting diode (LED), aliquid crystal display device, and an electronic paper performingdisplay by an electrophoretic method or the like.

For example, in a basic structure of an organic EL element, a layercontaining a light-emitting organic compound is provided between a pairof electrodes. By voltage application to this element, thelight-emitting organic compound can emit light. A display deviceincluding such an organic EL element needs no backlight which isnecessary for liquid crystal display devices and the like; therefore,thin, lightweight, high contrast, and low power consumption displaydevices can be obtained. For example, Patent Document 1 discloses anexample of a display device including an organic EL element.

Furthermore, Patent Document 2 discloses a flexible active matrixlight-emitting device in which an organic EL element and a transistorserving as a switching element are provided over a film substrate.

REFERENCES Patent Documents

[Patent Document 1] Japanese Published Patent Application No.2002-324673

[Patent Document 2] Japanese Published Patent Application No.2003-174153

DISCLOSURE OF INVENTION

An object of one embodiment of the present invention is to provide adisplay device that is suitable for increasing in size. Another objectof one embodiment of the present invention is to provide a displaydevice in which display unevenness is suppressed. Another object of oneembodiment of the present invention is to provide a display devicecapable of uniform display in a display surface. Another object of oneembodiment of the present invention is to provide a display devicecapable of display in which a joint portion in a display surface ishardly seen.

Another object is to provide a novel display device.

Note that the descriptions of these objects do not disturb the existenceof other objects. In one embodiment of the present invention, there isno need to achieve all the objects. Objects other than the above objectswill be apparent from and can be derived from the description of thespecification and the like.

One embodiment of the present invention is a display device includingtwo display panels, two plates, two stages, two driver circuits, twoadjusting units, and a frame. The frame includes a plurality of pillars,a plurality of beams, and a plurality of bottom plates. The adjustingunits have a function of adjusting positions and angles of the stagesand are fixed to the frame. The driver circuits have a function ofoutputting signals for driving the display panels. The stages are fixedto the adjusting units and include regions provided with the drivercircuits and the plates. The plates include first surfaces provided withmechanisms for connection to the stages and include convexly curvedsurfaces. Each display panel includes a display portion, an operatingcircuit portion, a terminal, an external electrode, a transparentportion, and a first portion and has flexibility. The display portionhas a function of displaying an image. The operating circuit portionincludes a circuit having a function of outputting a signal to thedisplay portion and a wiring capable of electrically connecting thecircuit to the terminal. The operating circuit is located in a regionadjacent to the display portion. The terminal is electrically connectedto the external electrode. The external electrode has a function oftransmitting the signal output from the driver circuit to the operatingcircuit portion. The transparent portion includes a region transmittingvisible light and is located in a region not overlapping with theoperating circuit portion and adjacent to one side of the displayportion. In each display panel, the first portion includes a regionbetween the terminal and the display portion. Surfaces opposite to imagedisplay surfaces of the display panels are fixed to second surfacesopposite to the first surfaces of the plates so that the transparentportions and parts of the display portions extend beyond the plates. Thefirst portions are provided along the convexly curved surfaces. Thedisplay portion of one of the two display panels overlaps with thetransparent portion of the other display panel.

The display device further including a video signal divider and a videooutput unit is also one embodiment of the present invention. The videooutput unit has a function of outputting a video signal or an imagesignal to the video signal divider. The video signal divider has afunction of dividing the video signal or the image signal into aplurality of signals and outputting the signals to the driver circuits.

The display device in which, in each display panel, the transparentportion is located in a region not overlapping with the operatingcircuit portion and adjacent to two sides of the display portion, andthe first portion of one of the two display panels overlaps with thefirst portion of the other display panel is also one embodiment of thepresent invention.

In the display device, the driver circuits preferably have a function ofadjusting color tone, luminance, or the like of images or video that isto be displayed on the display panels.

The display device in which the display portions each include aplurality of pixels, the pixels each include a light-emitting elementand a transistor, and each light-emitting element includes a lowerelectrode, an upper electrode, and an EL layer between the lowerelectrode and the upper electrode is also one embodiment of the presentinvention.

The display device in which the display portions each include anauxiliary electrode and the auxiliary electrode is in contact with theupper electrode in a region between adjacent lower electrodes is alsoone embodiment of the present invention.

One embodiment of the present invention can provide a display devicethat is suitable for increasing in size. One embodiment of the presentinvention can provide a display device in which display unevenness issuppressed. One embodiment of the present invention can provide adisplay device capable of uniform display in a display surface. Oneembodiment of the present invention can provide a display device capableof display in which a joint portion in a display surface is hardly seen.

One embodiment of the present invention can provide a novel displaydevice. Note that the description of these effects does not disturb theexistence of other effects. One embodiment of the present invention doesnot necessarily achieve all the effects listed above. Other effects willbe apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

BRIEF DESCRIPTION OF DRAWINGS

In the accompanying drawings:

FIGS. 1A to 1C illustrate a display device according to one embodiment;

FIGS. 2A and 2B illustrate a display device according to one embodiment;

FIGS. 3A and 3B each illustrate a display device according to oneembodiment;

FIGS. 4A to 4D illustrate a display device according to one embodiment;

FIGS. 5A and 5B illustrate a display device according to one embodiment;

FIGS. 6A to 6D illustrate a display panel according to one embodiment;

FIGS. 7A to 7C illustrate a display panel according to one embodiment;

FIGS. 8A to 8C each illustrate a positional relation between displaypanels according to one embodiment;

FIGS. 9A to 9C illustrate display panels according to one embodiment;

FIG. 10 illustrates a display panel according to one embodiment;

FIGS. 11A, 11B, 11C, 11D1, and 11D2 illustrate display panels accordingto one embodiment;

FIG. 12 is a circuit diagram of a pixel of a display panel according toone embodiment;

FIGS. 13A and 13B are each a circuit diagram of a pixel of a displaypanel according to one embodiment;

FIGS. 14A and 14B are each a circuit diagram of a pixel of a displaypanel according to one embodiment;

FIGS. 15A and 15B are each a circuit diagram of a pixel of a displaypanel according to one embodiment;

FIGS. 16A and 16B are each a circuit diagram of a pixel of a displaypanel according to one embodiment;

FIGS. 17A and 17B illustrate display panels according to one embodiment;

FIGS. 18A to 18C illustrate a touch panel according to one embodiment;

FIGS. 19A and 19B illustrate a touch panel according to one embodiment;

FIGS. 20A to 20C illustrate touch panels according to one embodiment;

FIGS. 21A to 21C illustrate touch panels according to one embodiment;

FIGS. 22A to 22D illustrate touch panels according to one embodiment;

FIGS. 23A to 23D illustrate touch panels according to one embodiment;

FIGS. 24A to 24C illustrate touch panels according to one embodiment;

FIGS. 25A to 25F illustrate touch panels according to one embodiment;

FIG. 26 illustrates a touch panel according to one embodiment;

FIG. 27 illustrates a touch panel according to one embodiment;

FIGS. 28A and 28B are photographs of a display panel according to oneexample;

FIG. 29 is a photograph of a display device according to one example;

FIGS. 30A and 30B are photographs of a display panel according to oneexample;

FIGS. 31A and 31B are photographs of a display device according to oneexample;

FIG. 32 is a photograph of a display device according to one example;

FIGS. 33A and 33B are photographs of a display device according to oneexample; and

FIG. 34 is a photograph of a display device according to one example.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments will be described in detail with reference to drawings. Notethat the present invention is not limited to the description below, andit is easily understood by those skilled in the art that various changesand modifications can be made without departing from the spirit andscope of the present invention. Accordingly, the present inventionshould not be interpreted as being limited to the content of theembodiments below.

Note that in the structures of the invention described below, the sameportions or portions having similar functions are denoted by the samereference numerals in different drawings, and description of suchportions is not repeated. Further, the same hatching pattern is appliedto portions having similar functions, and the portions are notespecially denoted by reference numerals in some cases.

Note that in each drawing described in this specification, the size, thelayer thickness, or the region of each component is exaggerated forclarity in some cases. Therefore, embodiments of the present inventionare not limited to such a scale.

Note that in this specification and the like, ordinal numbers such as“first”, “second”, and the like are used in order to avoid confusionamong components and do not limit the number.

Note that in this specification, the description “A has a shape suchthat an end portion extends beyond an end portion of B” may indicate,for example, the case where at least one of end portions of A ispositioned on an outer side than at least one of end portions of B in atop view or a cross-sectional view.

Note that the terms “film” and “layer” can be interchanged with eachother depending on the case or circumstances. For example, the term“conductive layer” can be changed into the term “conductive film” insome cases. Also, the term “insulating film” can be changed into theterm “insulating layer” in some cases.

Embodiment 1

In this embodiment, structure examples of a display device of oneembodiment of the present invention are described with reference todrawings.

In each of two display panels included in the display device of oneembodiment of the present invention, a transparent portion is providedadjacent to one side of a display portion. The display portion has afunction of displaying an image, and the transparent portion transmitslight emitted from the display portion. The two display panels arearranged to overlap with each other, and the transparent portion of oneof the display panels and the display portion of the other display panelare arranged to overlap with each other. Thus, the display device canperform large-area display in which the joint portion of the displayportions is hardly seen.

Each component of the display device will be described in detail below.

FIG. 1A is a front view of a display device 20A. FIG. 1B is across-sectional view of the display device 20A along the dashed-dottedline Y1-Y2 in FIG. 1A.

The display device 20A includes two display panels 40, two plates 50,two stages 61, two driver circuits 62, two adjusting units 63, and aframe 21A.

Note that one of two components in the display device 20A is denoted bya reference numeral with the letter “a”, and the other is denoted by areference numeral with the letter “b”. Note that in describing commonparts of the two components, the two components are denoted by referencenumerals without the letters “a” and “b” in some cases. The same canapply to two components included in a display device 10 and a displaydevice 20B which will be described later.

FIGS. 2A and 2B show the display device 20A from which the plates 50 andthe display panels 40 are removed. FIG. 2A is a front view of thedisplay device 20A. FIG. 2B is a cross-sectional view of the displaydevice 20A along the dashed-dotted line Y3-Y4 in FIG. 2A. Components ofthe display device 20A which are not shown in FIG. 1A and theirreference numerals are shown in FIG. 2A.

In the display device 20A, the display panel 40 is attached to the plate50 with a part of the display panel 40 bent (see FIG. 1B). FIG. 1C is atop view of the display panel 40 placed alone on a flat surface.

In the display device 20A, a display portion 41 a of the display panel40 a and a display portion 41 b of the display panel 40 b are arrangedseamlessly. Thus, a display portion 11A can be used as one displayregion displaying an image or video. The display portion 11A is a regionsurrounded by a thick dashed line in FIG. 1A.

The frame 21A includes a plurality of pillars and a plurality of beams.The frame 21A can be provided with the two adjusting units 63. In thisembodiment, the adjusting units 63 are fixed to the beams of the frame21A (see FIG. 2A).

The frame 21A can be formed of a metal material which is processedeasily and not deformed easily. Examples of the metal material includealuminum; copper; manganese; magnesium; an alloy of aluminum, copper,manganese, or magnesium (an aluminum alloy); iron; chromium; nickel; andan alloy of iron, chromium, or nickel (stainless steel).

The adjusting unit 63 has a function of adjusting the position and theangle of the stage 61 fixed onto the adjusting unit 63. Specifically,the adjusting unit 63 allows the display panel 40 connected to the stage61 to move in an X-axis direction and/or a Y-axis direction or to rotatearound a Z-axis.

The adjusting unit 63 can adjust the positions of the two display panels40 so that the display portions 41 a and 41 b of the display panels 40become parallel and have no space therebetween.

As the adjusting unit 63, a one-axis stage (also referred to as anX-axis stage) for adjusting the position in the X-axis direction, aone-axis stage (also referred to as a Y-axis stage) for adjusting theposition in the Y-axis direction, and a tilt stage (also referred to asa goniometer stage) for adjusting the position in a direction ofrotation around the Z-axis in FIG. 1B can be used in combination.Alternatively, a two-axis stage for adjusting the position in the X-axisdirection and the Y-axis direction and the tilt stage may be used incombination. In this embodiment, the adjusting unit 63 includes theX-axis stage, the Y-axis stage, and the goniometer stage in the orderfrom the side fixed to the frame 21A (see FIGS. 2A and 2B).

The driver circuit 62 has a function of converting an image signal or avideo signal input to the driver circuit 62 to a signal for driving thedisplay panel 40 and of outputting the converted signal to the displaypanel 40. Furthermore, the driver circuit 62 has a function of supplyinga power supply voltage required for light emission of the display panel40.

The driver circuit 62 preferably has a function of adjusting color tone,luminance, or the like in display of the display panel 40, in which casevariation can be corrected when the variation in display performancebetween the display panel 40 a and the display panel 40 b occurs.

The driver circuit 62 may have a function of generating an image signalor a video signal. A cable 64 may be connected to the driver circuit 62.For example, a signal can be input to the driver circuit 62 from anexternal video output device through the cable 64 (see FIG. 2B).

FIG. 3A is a side view illustrating the display device 10 of oneembodiment of the present invention. The display device 10 includes thedisplay device 20A, a video signal divider 22, and a video output unit23. In the display device 10, for example, a frame 21 includes the frame21A and a plurality of bottom plates over which the video signal divider22 and the video output unit 23 are provided. The frame 21 can be formedof a metal material similar to that of the frame 21A.

In the display device 10, the driver circuit 62 a and the driver circuit62 b are electrically connected to the video signal divider 22 throughthe cable 64 a and the cable 64 b, respectively. The video signaldivider 22 is electrically connected to the video output unit 23 througha cable 65. Note that the display panel 40, the plate 50, and the stage61 are collectively referred to as a component group 60 (60 a or 60 b)in FIG. 3A.

The video output unit 23 has a function of outputting, to the videosignal divider 22, a signal for an image or video that is to bedisplayed on the display panels 40 a and 40 b. As the video output unit23, a recording/reproducing device such as a Blu-ray Disc recorder or adigital versatile disc (DVD) recorder can be used.

In the case where a plurality of display panels is arranged in a tilepattern to form the display device, an uncompressed disk recorder (UDR)capable of outputting an image with high resolution, e.g., 4K (3840×2160pixels) or 8K (7680×4320 pixels), without compression can be favorablyused as the video output unit 23. The number of display panels arrangedin a tile pattern is, for example, nine (3×3) or thirty-six (6×6).

The video signal divider 22 has a function of dividing an input signalfor an image or video and outputting the divided signals to a pluralityof driver circuits or display devices.

For example, in the case where an image signal for certain displayresolution is divided into nine and the divided signals are output tonine display devices by the video signal divider 22, an image displayedusing an image signal output to and received by each display deviceprovides a pixel aspect equal to an original image and 1/9 displayresolution. Then, display regions of the nine display devices arearranged to correspond to the order in which the original image signalis divided. Thus, an image can be displayed with the display resolutionof the original image. Note that here, the term “pixel aspect” refers tothe ratio between the display resolution of an image in the longitudinaldirection and the display resolution of the image in the horizontaldirection. The term “display resolution” refers to the total number ofpixels forming a display portion of a display device or the total numberof pixels forming an image.

In this embodiment, the image signal or the video signal input to thevideo signal divider 22 is divided into two and the divided signals areoutput to the two driver circuits 62.

Referring again to the display device 20A, the stage 61 has a regionwhere the driver circuit 62 can be provided and a region where the plate50 can be provided (see FIG. 1B). Since the stage 61 has the regionwhere the driver circuit 62 can be provided, the replacement of acomponent due to the specification change of the driver circuit 62 ormaintenance can be performed easily, for example.

Note that the driver circuit 62 may be reduced in volume so as to beattached to the surface of the stage 61 opposite to the region where theplate 50 can be provided. This can reduce the region of the stage 61where the driver circuit 62 is provided and accordingly can reduce thedepth of the display device 20A (the length in the Z-axis direction inFIG. 1B).

The stage 61 can be formed of a metal material similar to that of theframe 21A.

The plate 50 includes a first surface provided with a mechanism forconnection to the stage 61 and a side surface provided with a convexlycurved surface (see FIG. 1B). The plate 50 includes a region where thedisplay panel 40 is provided on a surface (hereinafter referred to as asecond surface) opposite to the first surface. In this embodiment, themechanism includes a depression 51 to which a part of the stage 61 canbe fit and a fastening 52 capable of sliding in the Y-axis direction.However, the mechanism is not limited thereto. Note that not the plate50, but the stage 61 may include a mechanism for setting the plate 50 tothe stage 61.

The plate 50 needs to be connected precisely to the stage 61 toaccurately adjust the relative positions of the display portion 41 a andthe display portion 41 b using the adjusting unit 63. The alignment ofthe plate 50 and the stage 61 in the Y-axis direction can be achievedusing the depression 51 and the fastening 52. The alignment of the plate50 and the stage 61 in the X-axis direction can be achieved using guides53 to be described later.

The plate 50 can be formed of a metal material similar to that of theframe 21A.

The display panel 40 is provided with the display portion 41, atransparent portion 42, an operating circuit portion 43, a terminal 45,and an external electrode 46 (see FIG. 1C). The display panel 40 hasflexibility.

The terminal 45 is electrically connected to a wiring in the operatingcircuit portion 43 and the external electrode 46. The external electrode46 is electrically connected to the driver circuit 62, and a signal isoutput from the driver circuit 62 to the display panel 40 through theexternal electrode 46 (see FIG. 1B). In this embodiment, a flexibleprinted circuit (FPC) is used as an example of the external electrode46.

The display portion 41 has a function of displaying an image. Thedisplay portion 41 may include a light-emitting element such as anorganic EL element.

The operating circuit portion 43 has a function of outputting a signalto the display portion 41. The operating circuit portion 43 includes ascan line driver circuit, a signal line driver circuit, and the like.Wirings for connecting the external electrode 46 to the scan line drivercircuit and the signal line driver circuit are also included in theoperating circuit portion 43.

In the display panel 40, the operating circuit portion 43 is provided ina position adjacent to the display portion 41. In the structure shown inFIG. 1C, the operating circuit portion 43 is adjacent to two sides ofthe display portion 41. The operating circuit portion 43 may be adjacentto one side of the display portion 41. The operating circuit portion 43may be a region which does not transmit visible light or a region whichtransmits visible light, depending on the structure of the scan linedriver circuit or the like.

The transparent portion 42 includes a region which transmits visiblelight. A region where the transparent portion 42 is located is adjacentto the display portion 41 and does not overlap with the operatingcircuit portion 43.

In the example shown in FIG. 1C, the transparent portion 42 is adjacentto a bottom side of the display portion 41 (a side opposite to the sidenear the terminal 45); however, the position of the transparent portion42 is not limited thereto. For example, the transparent portion 42 maybe adjacent to a right side of the display portion 41 (a side oppositeto a longer side of the display portion 41 which is adjacent to theoperating circuit portion 43).

The transparent portion 42 may be adjacent to two sides of the displayportion 41 (e.g., the bottom side and the right side). The transparentportion 42 adjacent to two sides of the display portion 41 is preferablebecause the display panels 40 can be seamlessly arranged in a tilepattern. Furthermore, when there is no space between the display portion41 and the transparent portion 42, large-area display can be performedin which a joint portion of the display panels 40 arranged in a tilepattern is hardly seen.

It is preferable that the transparent portion 42 have hightransmittance, because the boundary between a region behind thetransparent portion 42 and the other region is hardly seen in performingdisplay on the display portion 41. Furthermore, it is preferable thatthe refractive index of a material of the transparent portion 42 beclose to 1 because the reflection of external light can be suppressed.

The width of the transparent portion 42 (the length of the transparentportion 42 in the Y-axis direction in FIG. 1B) is equal to the distancebetween an end portion of the display panel 40 and a side of the displayportion 41 which is adjacent to the transparent portion 42 (see FIG.1C). The transparent portion 42 may include a sealing layer having afunction of suppressing the entry of an impurity such as water into thelight-emitting element of the display portion 41. That is, the width ofthe transparent portion 42 can be set depending on the sealingperformance of the sealing layer and/or reliability required for thelight-emitting element.

A specific structure of the display panel will be described in detail inEmbodiment 2.

FIG. 1B shows a structure in which the two display panels 40 arearranged in the Y-axis direction so that the display portion 41 a andthe display portion 41 b are arranged seamlessly.

Note that in the two display panels shown in FIGS. 1A and 1B, thedisplay panel located on the rear side (the display panel whose frontsurface is overlapped by the transparent portion 42 of the other displaypanel) is denoted by 40 a, and the display panel located on the frontside is denoted by 40 b. Note that the positional relation and theconnection relation between the display panel 40 a and the plate 50 aare equal to the positional relation and the connection relation betweenthe display panel 40 b and the plate 50 b.

In FIG. 1B, the display panel 40 has a surface where display on thedisplay portion 41 can be seen and a surface opposite thereto(hereinafter the latter surface is referred to as a display rearsurface), and the display rear surface is in contact with the secondsurface and the convexly curved surface of the plate 50.

The display rear surface and the second surface may adhere to each otheror be fixed to each other to be attachable to and detachable from eachother. In the case where the display rear surface and the second surfaceare attachable to and detachable from each other, the display panel 40can be replaced easily.

For example, a film having an adsorbing property (hereinafter referredto as an adsorptive film) can be used to make the display rear surfaceand the second surface attachable to and detachable from each other. Airbetween an object and the adsorptive film is removed to produce alow-pressure or vacuum state therebetween, so that the adsorptive filmcan be attached to the object. Alternatively, an adhesive film may beused to make the display rear surface and the second surface attachableto and detachable from each other.

In the case of using the adsorptive film or the adhesive film to fix thedisplay rear surface and the second surface to each other, the film isattached to the second surface first. The film may be attached to eitherthe whole area of the second surface or a part thereof. In the lattercase, the film is preferably attached to at least a region of the secondsurface in the vicinity of the convexly curved surface. This can preventthe display panel 40 in the vicinity of an upper portion of the displayportion 41 from being apart from the second surface in the case where afirst portion 44 of the display panel 40 is bent along the convexlycurved surface.

In the display panel 40, a region between the terminal 45 and thedisplay portion 41 is the first portion 44 (see FIG. 1C). The firstportion 44 is preferably provided along the convexly curved surface ofthe plate 50 as shown in FIG. 1B.

Furthermore, it is preferable that the first portion 44 and the convexlycurved surface not be fixed to each other. Such a structure can enlargethe movable area of the external electrode 46 and increase the degree offlexibility in connection between the external electrode 46 and thedriver circuit 62. In addition, two display panels 80 can be arrangedeasily in the X-axis direction as described later.

Note that the first portion 44 of the display panel 40 is notnecessarily provided along the whole area of the convexly curved surfaceof the plate 50 and may be provided along a part of the convexly curvedsurface as shown in FIG. 3B. Such a structure can increase the curvatureradius of the first portion 44 and reduce physical stress applied to thedisplay panel 40 accordingly.

As shown in FIG. 1B, the display panel 40 b is fixed to the plate 50 bso that the transparent portion 42 b and a part of the display portion41 b extend beyond the plate 50 b. The part of the display portion 41 bextending beyond the plate 50 b allows the display portion 41 b to beplaced on the display panel 40 a without contact between the plate 50 band the first portion 44 a.

For example, the length in the Y-axis direction of the part of thedisplay portion 41 b extended beyond the plate 50 b can be determined bymaking the top side of the display portion 41 a align with the bottomside of the display portion 41 b in the Z-axis direction.

It is preferable that, in a portion where the transparent portion 42 band the display portion 41 a are in contact with each other, air and thelike not be present between the transparent portion 42 b and the displayportion 41 a. Furthermore, it is preferable that the transparent portion42 b and the display portion 41 a be attachable to and detachable fromeach other.

The above-described adsorptive film can be used to make the transparentportion 42 b and the display portion 41 a attachable to and detachablefrom each other. In the case of using the adsorptive film, it ispreferable that the difference between the refractive index of thematerial of the transparent portion 42 b and the refractive index of amaterial of the adsorptive film be small. This can suppress thereflection of external light at the interface between the transparentportion 42 b and the adsorptive film and increase visibility of displayon the display portion 41 a in a region overlapping with the transparentportion 42 b.

Since the display panels 40 have flexibility, the plates 50 a and 50 bcan be arranged so that the second surfaces thereof form one plane and apart of the display panel 40 b extending beyond the plate 50 b can bebent and placed on the surface of the display panel 40 a.

By arranging the plates 50 a and 50 b so that the second surfacesthereof form one plane, a display surface of the display portion 11A canbe made approximately flat without steps.

The process for setting the display panels 40 a and 40 b to form thedisplay device 20A is described below with reference to FIGS. 1A and 1Band FIGS. 2A and 2B.

Note that the adjusting units 63 a and 63 b and the stages 61 a and 61 bare provided for the frame 21A in advance. First, the driver circuits 62a and 62 b are set onto the stages 61 a and 61 b, respectively (seeFIGS. 2A and 2B).

Then, the plate 50 a is made to adhere to the display panel 40 a orfixed to the display panel 40 a so as to be attachable thereto anddetachable therefrom. Specifically, the display rear surface of thedisplay panel 40 a and the second surface of the plate 50 a are disposedin close contact with each other with the adsorptive film or the filmhaving an adhesion property. At this time, it is preferable that thefirst portion 44 a and the convexly curved surface of the plate 50 a notbe fixed to each other.

The plate 50 a is provided for the stage 61 a. Specifically, a part ofthe stage 61 a is fit into the depression 51 a, and the first surface ofthe plate 50 a is made to overlap with a side surface of the stage 61 aso as to be in contact with each other. After that, the fastening 52 ais slid up to fix the plate 50 a to the stage 61 a. Then, the externalelectrode 46 a and the driver circuit 62 a are connected to each other.

Next, the display panel 40 b is fixed to the plate 50 b in a mannersimilar to the above-described manner in which the display panel 40 a isfixed to the plate 50 a.

The plate 50 b is provided for the stage 61 b. The plate 50 b can beprovided for the stage 61 b in a manner similar to the above-describedmanner in which the plate 50 a is provided for the stage 61 a. Note thatthe plate 50 b is provided such that the part of the display panel 40 bextended beyond the plate 50 b is located on the front surface of thedisplay panel 40 a. Then, the external electrode 46 b and the drivercircuit 62 b are connected to each other.

Note that when the plate 50 b is provided for the stage 61 b, the stage61 a may be moved in the Y-axis direction using the adjusting unit 63 aso that the plate 50 b does not contact the first portion 44 a incontact with the convexly curved surface of the plate 50 a.Alternatively, the stage 61 b may be moved in the Y-axis direction usingthe adjusting unit 63 b.

Then, the position or the angle of the display portion 41 a is adjustedusing the adjusting unit 63 a and/or the position or the angle of thedisplay portion 41 b is adjusted using the adjusting unit 63 b so thatthe joint portion of the display portions 41 a and 41 b is hardly seenwhen the display portion 11A is seen in the Z-axis direction.

In one method for relative alignment of the display portions 41 a and 41b, for example, an image is displayed on the display portion 11A as onedisplay area, and then, a discontinuous portion of the image at or inthe vicinity of the boundary between the display portions 41 a and 41 bis made as small as possible using the adjusting unit 63 a and/or theadjusting unit 63 b. As the image to be displayed on the display portion11A at this time, for example, an image having a stripe-like scalecrossing the discontinuous portion is used, in which case the relativealignment of the display portions 41 a and 41 b can be easily performed.

Finally, the transparent portion 42 b and the display portion 41 a arefixed to each other so as to be attachable to and detachable from eachother while air is prevented from being present therebetween (see FIGS.1A and 1B). For example, the adsorptive film can be used to fix them soas to be attachable to and detachable from each other.

Through the above-described process, the display panels 40 a and 40 bcan be set in the display device 10.

Modification Example 1

In this embodiment described so far, the structure of the display device20A in which the two display panels are adjacent to each other in theY-axis direction is described. In Modification Example 1, a structure ofa display device 20B in which two display panels are adjacent to eachother in the X-axis direction will be described.

Note that only differences between the display device 20B and thedisplay device 20A shown in FIGS. 1A and 1B will be described below.

FIG. 4A is a front view of the display device 20B in which two displaypanels 80 a and 80 b are arranged in the X-axis direction. FIG. 4B is across-sectional view of the display device 20B along the dashed-dottedline Y5-Y6 in FIG. 4A. Note that in the two display panels shown inFIGS. 4A and 4B, the display panel located on the rear side is denotedby 80 a, and the display panel located on the front side is denoted by80 b.

In the display device 20B, the display panel 80 is attached to the plate90 with a part of the display panel 80 bent (see FIG. 4B). FIG. 4C is atop view of the display panel 80 placed alone on a flat surface.

FIGS. 5A and 5B show the display device 20B from which the plates 90 andthe display panels 80 are removed. FIG. 5A is a front view of thedisplay device 20B. FIG. 5B is a cross-sectional view of the displaydevice 20B along the dashed-dotted line Y7-Y8 in FIG. 5A. Components ofthe display device 20B which are not shown in FIG. 4A and theirreference numerals are shown in FIG. 5A.

In the display device 20B, the display portion 41 a of the display panel80 a and the display portion 41 b of the display panel 80 b are arrangedseamlessly. Thus, a display portion 11B can be used as one displayregion displaying an image or video. The display portion 11B is a regionsurrounded by a thick dashed line in FIG. 4A.

A frame 21B differs from the frame 21A shown in FIG. 2A in that theframe 21B includes a plurality of pillars and a plurality of beams withwhich the two display panels 80 are arranged in the X-axis direction(see FIG. 5A).

FIG. 4D is a rear view of a stage 91 and a plate 90 in a state where theplate 90 is provided for the stage 91. In the stage 91, the width (thelength in the X-axis direction) of a lower portion of a region where theplate 90 is provided is smaller than the width of an upper portion ofthe region where the plate 90 is provided, which is different from thatin the stage 61. A first surface of the plate 90 is provided with theguides 53. The distance between the two guides 53 is equal to the widthof the lower portion of the stage 91 and is indicated by W1. With such astructure, the positions of the plate 90 and the stage 91 in the X-axisdirection can be aligned with high precision at the time of attachingthe plate 90 to the stage 91.

The frame 21B and the stage 91 can be formed of a metal material similarto that of the frame 21A. The frame 21B and the stage 91 may be formedof different materials.

The display panel 80 is provided with a transparent portion 82 in aposition adjacent to the right side and the lower side of the displayportion 41 (see FIG. 4C). As shown in FIG. 4A, the display portion 41 aand the transparent portion 82 b overlap with each other in the displaydevice 20B. Furthermore, the first portion 44 a of the display panel 80a and the first portion 44 b of the display panel 80 b overlap with eachother. Such a structure allows a plurality of display panels 80 to bearranged in the X-axis direction and the Y-axis direction without thejoint portion of the display portions 41, achieving large-area display.Note that FIGS. 1A and 1B and the description relating to FIGS. 1A and1B in this specification can be referred to for a method of arrangingthe display panels 80 in the Y-axis direction.

The display panel 80 b is fixed to the plate 90 b so that thetransparent portion 82 b and a part of the display portion 41 b extendbeyond the plate 90 b in the X-axis direction and the Y-axis direction(see FIG. 4A).

For example, the length in the X-axis direction of the part of thedisplay portion 41 b extended beyond the plate 90 b can be determined bymaking the right side of the display portion 41 b align with the leftside of the display portion 41 a in the Z-axis direction.

The process for setting the display panels 80 a and 80 b to form thedisplay device 20B is described below with reference to FIGS. 4A to 4Dand FIGS. 5A and 5B.

Note that the adjusting units 63 a and 63 b and stages 91 a and 91 b areprovided for the frame 21B in advance. First, the driver circuits 62 aand 62 b are set onto the stages 91 a and 91 b, respectively (see FIGS.5A and 5B).

Then, the plate 90 a is made to adhere to the display panel 80 a orfixed to the display panel 80 a so as to be attachable thereto anddetachable therefrom. Specifically, the display rear surface of thedisplay panel 80 a and the second surface of the plate 90 a are disposedin close contact with each other with the adsorptive film or the filmhaving an adhesion property. At this time, it is preferable that thefirst portion 44 a and the convexly curved surface of the plate 90 a notbe fixed to each other.

The plate 90 a is provided for the stage 91 a. Specifically, a part ofthe stage 91 a is fit into the depression 51 a, and the plate 90 a ismoved in the X-axis direction so that a lower portion of the stage 91 ais positioned between the two guides 53 a. Then, the first surface ofthe plate 90 a is made to overlap with a side surface of the stage 91 aso that they are in contact with each other. After that, the fastening52 a is pulled up to fix the plate 90 a to the stage 91 a. Then, theexternal electrode 46 a and the driver circuit 62 a are connected toeach other.

Next, the display panel 80 b is fixed to the plate 90 b in a mannersimilar to the above-described manner in which the display panel 80 a isfixed to the plate 90 a. Note that a convexly curved surface of theplate 90 b and the first portion 44 b are not fixed to each other.

The plate 90 b is provided for the stage 91 b. The plate 90 b can beprovided for the stage 91 b in a manner similar to the above-describedmanner in which the plate 90 a is provided for the stage 91 a. Note thatthe plate 90 b is provided such that the part of the display panel 80 bextended beyond the plate 90 b is located on the front surface of thedisplay panel 80 a.

Note that when the plate 90 b is attached to the stage 91 b, the stage91 a may be moved in the X-axis direction using the adjusting unit 63 aso that the plate 90 b does not contact the display panel 80 a.Alternatively, the stage 91 b may be moved in the X-axis direction usingthe adjusting unit 63 b.

Then, the position or the angle of the display portion 41 a is adjustedusing the adjusting unit 63 a or the position or the angle of thedisplay portion 41 b is adjusted using the adjusting unit 63 b so thatthe joint portion of the display portions 41 a and 41 b is hardly seenwhen the display portion 11B is seen in the Z-axis direction.

Finally, the transparent portion 82 b and the display portion 41 a arefixed to each other so as to be attachable to and detachable from eachother while air is prevented from being present therebetween (see FIGS.4A and 4B). For example, the adsorptive film can be used to fix them soas to be attachable to and detachable from each other.

Finally, the first portion 44 b is placed along the convexly curvedsurface of the plate 90 a and the first portion 44 a, and the externalelectrode 46 b is connected to the driver circuit 62 b.

Note that a curvature radius of a bent portion of the first portion 44 bis longer than a curvature radius of a bent portion of the first portion44 a because the first portion 44 b overlaps the first portion 44 a.Therefore, the external electrode 46 b required for connection betweenthe display panel 80 b and the driver circuit 62 b is longer than theexternal electrode 46 a required for connected between the display panel80 a and the driver circuit 62 a (see FIG. 4A). This means that excesstension is generated in the external electrode 46 b and the terminal 45b when the display panel 80 b and the driver circuit 62 b are connectedto each other. Thus, the length of the external electrode 46 b or thefirst portion 44 b in the longitudinal direction of the display panel 80b is preferably adjusted. A connection position of the driver circuit 62b and the external electrode 46 b may be adjusted.

Structure Example of Display Portion

Next, a structure example of a display portion of a display panelincluded in a display device of one embodiment of the present inventionwill be described. FIG. 6A is a top view of a display panel 30 in whicha transparent portion 32 is adjacent to two sides of the display portion41. FIG. 6B is a top view in which a region P in FIG. 6A is enlarged,and FIG. 6C is a top view in which a region Q in FIG. 6A is enlarged.

As illustrated in FIG. 6C, in the display portion 41, a plurality ofpixels 31 is arranged in a matrix. In the case where the display panel30 which is capable of full color display with three colors of red,blue, and green is formed, the pixel 31 can display any of the threecolors. Alternatively, a pixel which can display white or yellow inaddition to the three colors may be provided. A region including thepixels 31 corresponds to the display portion 41.

One pixel 31 is electrically connected to a wiring 34 c and a wiring 34d. The plurality of wirings 34 c each intersects with the wiring 34 d,and is electrically connected to an operating circuit 33 c. Theplurality of wirings 34 d is electrically connected to an operatingcircuit 33 d. One of the operating circuits 33 c and 33 d can functionas a scan line driver circuit, and the other can function as a signalline driver circuit. A structure without one of the operating circuits33 c and 33 d or both of them may be employed.

In FIG. 6B, a plurality of wirings 35 electrically connected to theoperating circuit 33 c or the operating circuit 33 d is provided. Thewiring 35 is electrically connected to the external electrode 46 in aregion not shown in the figure and has a function of supplying a signalfrom the outside to the operating circuits 33 c and 33 d.

In FIG. 6B, a region including the operating circuit 33 c, the operatingcircuit 33 d, and the plurality of wirings 35 corresponds to theoperating circuit portion 43 in FIG. 6A.

In FIG. 6C, a region outside the pixel 31 provided closest to the endcorresponds to the transparent portion 32. The transparent portion 32does not include the members blocking visible light, such as the pixel31, the wiring 34 c, and the wiring 34 d. Note that in the case wherepart of the pixel 31, the wiring 34 c, or the wiring 34 d transmitsvisible light, the part of the pixel 31, the wiring 34 c, or the wiring34 d may be provided to extend to the transparent portion 32.

Here, the width W2 of the transparent portion 32 indicates the narrowestwidth of the transparent portion 32 provided in the display panel 30 insome cases. In the case where the width W2 of the display panel 30varies depending on the positions, the width of the shortest portion canbe referred to as the width W2. In FIG. 6C, the distance between thepixel 31 and the end surface of the substrate (that is, the width W2 ofthe transparent portion 32) in the vertical direction is the same asthat in the horizontal direction.

FIG. 6D is a cross-sectional view taken along the dashed-dotted lineX1-X2 in FIG. 6C. The display panel 30 illustrated in FIG. 6D includes apair of substrates (a substrate 36 and a substrate 37) each of whichtransmits visible light. The substrate 36 and the substrate 37 arebonded to each other with an adhesive layer 38. The pixel 31, the wiring34 d, and the like are provided for the substrate 36.

As illustrated in FIGS. 6C and 6D, in the case where the pixel 31 ispositioned closest to the end of the display portion 41, the width W2 ofthe transparent portion 42 is the distance between the end portion ofthe substrate 36 or the substrate 37 and the end portion of the pixel31.

Note that the end portion of the pixel 31 refers to the end portion ofthe member that is positioned closest to the end and blocks visiblelight in the pixel 31. Alternatively, in the case where a light-emittingelement including a layer containing a light-emitting organic compoundbetween a pair of electrodes (also referred to as an organic EL element)is used as the pixel 31, the end portion of the pixel 31 may be any ofthe end portion of the lower electrode, the end portion of the layercontaining a light-emitting organic compound, and the end portion of theupper electrode.

FIG. 7A shows the case where the position of the wiring 34 c isdifferent from that in FIG. 6C. FIG. 7B is a cross-sectional view takenalong dashed-dotted line Y9-Y10 in FIG. 7A, and FIG. 7C is across-sectional view taken along dashed-dotted line X3-X4 in FIG. 7A.

As illustrated in FIGS. 7A to 7C, in the case where the wiring 34 c ispositioned closest to the end of the display portion 41, the width W2 ofthe transparent portion 32 is the distance between the end portion ofthe substrate 36 or the substrate 37 and the end portion of the wiring34 c. In the case where the wiring 34 c transmits visible light, thetransparent portion 32 may include a region where the wiring 34 c isprovided.

Here, in the case where the density of pixels provided in the displayportion 41 of the display panel 30 is high, misalignment may occur whenthe two display panels 30 are bonded.

FIG. 8A shows a positional relationship between the display portion 41 aof the display panel 30 a provided on the rear side and the displayportion 41 b of the display panel 30 b provided on the front side, seenfrom the display surface side. FIG. 8A shows the vicinities of thecorner portions of the display portions 41 a and 41 b. Part of thedisplay portion 41 a is covered with the transparent portion 32 b.

FIG. 8A shows an example in which adjacent pixels 31 a and 31 b arerelatively deviated in one direction (X-axis direction). The arrow inthe drawing denotes a direction in which the display panel 30 a isdeviated from the display panel 30 b. FIG. 8B shows an example in whichthe adjacent pixels 31 a and 31 b are relatively deviated in a verticaldirection and a horizontal direction (X-axis direction and Y-axisdirection).

In the examples of FIGS. 8A and 8B, the distances deviated in thevertical direction and the horizontal direction are each shorter thanthe length of one pixel. In this case, image data of the image displayedon either one of the display portions 41 a and 41 b is correcteddepending on the deviation distance, whereby the display quality can bemaintained. Specifically, when the deviation makes the distance betweenthe pixels smaller, the data is corrected so that the gray level(luminance) of the pixels is low, and when the deviation makes thedistance between the pixels larger, the data is corrected so that thegray level (luminance) of the pixels is high. Alternatively, when thepixels are deviated by a distance of more than one pixel, the data iscorrected so that the pixel positioned on a rear side is not driven andthe image data is shifted by one column.

FIG. 8C shows an example in which the pixels 31 a and 31 b , whichshould be adjacent, are relatively deviated in one direction (X-axisdirection) by a distance of more than one pixel. When the deviation ofmore than one pixel occurs, the pixels are driven so that projectingpixels (pixels which are hatched) are not displayed. Note that the sameapplies to the case where the deviation direction is the Y-axisdirection.

When the plurality of display panels 30 are made to overlap with eachother, in order to suppress misalignment, each of the display panels 30is preferably provided with an alignment marker or the like.Alternatively, a projection and a depression may be formed on thesurfaces of the display panels 30, and the projection and the depressionmay be attached to each other in a region where the two display panels30 overlap.

Furthermore, in consideration of alignment accuracy, it is preferablethat pixels more than the pixels to be used be placed in advance in thedisplay portion 41 of the display panel 30. For example, it ispreferable that one or more, preferably three or more, furtherpreferably five or more extra pixel columns along either one or both ofa scan line and a signal line be provided in addition to the pixelcolumns used for display.

This embodiment can be combined with any other embodiment asappropriate.

Embodiment 2

In this embodiment, structure examples of a display panel which can beused in a display device of one embodiment of the present invention aredescribed with reference to drawings.

Although a display panel mainly including an organic EL element isdescribed in this embodiment as an example, a display panel which can beused in a display device of one embodiment of the present invention isnot limited to this example. A light-emitting panel or a display panelincluding another light-emitting element or display element which willbe described later in this embodiment as an example can also be used ina display device of one embodiment of the present invention.

Structure Example 1

FIG. 9A is a plan view of the display panel, and FIG. 9C is an exampleof a cross-sectional view taken along the dashed-dotted line A1-A2 inFIG. 9A. FIG. 9C also shows an example of a cross-sectional view of atransparent portion 810.

The display panel in Structure Example 1 is a top-emission display panelusing a color filter method. In this embodiment, the display panel canhave a structure in which subpixels of three colors of red (R), green(G), and blue (B), for example, express one color; a structure in whichsubpixels of four colors of R, G, B, and white (W) express one color; astructure in which subpixels of four colors of R, G, B, and yellow (Y)express one color; or the like. There is no particular limitation oncolor elements, and colors other than R, G, B, W, and Y may be used. Forexample, cyan, magenta, or the like may be used.

The display panel shown in FIG. 9A includes the transparent portion 810,a display portion 804, an operating circuit portion 806, and an FPC 808.The transparent portion 810 is adjacent to the display portion 804 andprovided along two sides of the display portion 804. The operatingcircuit portion 806 includes a scan line driver circuit, a signal linedriver circuit, and the like.

The display panel illustrated in FIG. 9C includes a substrate 701, anadhesive layer 703, an insulating layer 705, a plurality of transistors,a conductive layer 857, an insulating layer 815, an insulating layer816, an insulating layer 817, a plurality of light-emitting elements, aninsulating layer 821, an adhesive layer 822, a coloring layer 845, alight-blocking layer 847, an insulating layer 715, an adhesive layer713, and a substrate 711. The adhesive layer 822, the insulating layer715, the adhesive layer 713, and the substrate 711 transmit visiblelight. Light-emitting elements and transistors included in the displayportion 804 and the operating circuit portion 806 are sealed with theinsulating layer 705, the insulating layer 715, and the adhesive layer822.

The display portion 804 includes a transistor 820 and a light-emittingelement 830 over the substrate 701 with the adhesive layer 703 and theinsulating layer 705 provided therebetween. The light-emitting element830 includes a lower electrode 831 over the insulating layer 817, an ELlayer 833 over the lower electrode 831, and an upper electrode 835 overthe EL layer 833. That is, the light-emitting element 830 includes thelower electrode 831, the upper electrode 835, and the EL layer 833provided between the lower electrode 831 and the upper electrode 835.

The lower electrode 831 is electrically connected to a source electrodeor a drain electrode of the transistor 820. An end portion of the lowerelectrode 831 is covered with the insulating layer 821. The lowerelectrode 831 preferably reflects visible light. The upper electrode 835transmits visible light.

In addition, the display portion 804 includes the coloring layer 845overlapping with the light-emitting element 830 and the light-blockinglayer 847 overlapping with the insulating layer 821. The space betweenthe light-emitting element 830 and the coloring layer 845 is filled withthe adhesive layer 822.

The insulating layer 815 and the insulating layer 816 have an effect ofinhibiting diffusion of impurities to a semiconductor included in thetransistors. As the insulating layer 817, an insulating layer having aplanarization function is preferably selected in order to reduce surfaceunevenness due to the transistor.

Note that the insulating layer 815 and/or the insulating layer 816 maybe omitted in a region where a transistor is not provided in the displaypanel. In particular, it is preferable that the insulating layer 815and/or the insulating layer 816 not be formed in the transparent portion810 because the transmittance is improved. FIGS. 9A to 9C showstructures in each of which the insulating layer 815 is not formed inthe transparent portion 810. For example, silicon nitride and siliconoxynitride can be used as the insulating layer 815 and the insulatinglayer 816, respectively.

The operating circuit portion 806 includes a plurality of transistorsover the substrate 701 with the adhesive layer 703 and the insulatinglayer 705 provided therebetween. In FIG. 9C, one of transistors includedin the operating circuit portion 806 is illustrated.

The insulating layer 705 and the insulating layer 715 are preferablyhighly resistant to moisture, in which case entry of impurities such aswater into the light-emitting element 830 or the transistor 820 can beinhibited, leading to higher reliability of the display panel. When thedisplay panel includes a substrate, the surface of the display panel canbe protected from a physical impact, which is preferable. The substrate701 is bonded to the insulating layer 705 with the adhesive layer 703.The substrate 711 is bonded to the insulating layer 715 with theadhesive layer 713.

The conductive layer 857 is electrically connected to an externalelectrode through which a signal (e.g., a video signal, a clock signal,a start signal, or a reset signal) or a potential from the outside istransmitted to the operating circuit portion 806. Here, an example inwhich the FPC 808 is provided as the external electrode is described. Toprevent an increase in the number of manufacturing steps, the conductivelayer 857 is preferably formed using the same material and the samestep(s) as those of the electrode or the wiring in the display portionor the driver circuit portion. Here, an example is described in whichthe conductive layer 857 is formed using the same material and the samestep(s) as those of the electrodes of the transistor 820.

In the display panel in FIG. 9C, the FPC 808 is positioned over theinsulating layer 715. The connector 825 is connected to the conductivelayer 857 through an opening provided in the insulating layer 715, theadhesive layer 822, the insulating layer 817, the insulating layer 816,and the insulating layer 815. The connector 825 is also connected to theFPC 808. The FPC 808 and the conductive layer 857 are electricallyconnected to each other via the connector 825.

FIG. 10 shows an example of a cross-sectional view of a state where twodisplay panels each shown in FIG. 9C are attached to each other with anadhesive layer 723 therebetween. Note that the two display panels may befixed to each other so as to be attachable to and detachable from eachother using an adsorptive layer instead of the adhesive layer 723.

FIG. 10 shows the display portion 41 a (corresponding to the displayportion 804 shown in FIG. 9A) and the operating circuit portion 43 a(corresponding to the operating circuit portion 806 and the like shownin FIG. 9A) of the lower (rear) display panel and the display portion 41b (corresponding to the display portion 804 shown in FIG. 9A) and thetransparent portion 42 b (corresponding to the transparent portion 810shown in FIG. 9A) of the upper (front) display panel. Furthermore, thecross-sectional view shown in FIG. 10 shows an example of an overlappingportion (see FIG. 1B) where the two display panels 40 a and 40 bdescribed in Embodiment 1 overlap with each other.

In FIG. 10, the display panel positioned on the upper side (the displaysurface side) includes the transparent portion 810 adjacent to thedisplay portion 804. Furthermore, the display portion 804 of the lowerdisplay panel and the transparent portion 810 of the upper display paneloverlap each other. Thus, a non-display region between the displayregions of the two overlapping display panels can be reduced and evenremoved. As a result, a large-sized display device in which a jointportion of the display portions is hardly seen by the user can beobtained.

In FIG. 10, the adhesive layer 723 transmitting visible light isprovided between the display portion 804 of the lower display panel andthe transparent portion 810 of the upper display panel. The differencein refractive index between the adhesive layer 723 and the substrate 701of the upper display panel and/or the substrate 711 of the lower displaypanel is preferably small. Such a structure can reduce reflection by theinterface due to the difference in refractive index in a stack locatedover the display portion 804 of the lower display panel. In addition,display unevenness or luminance unevenness of a large display device canbe suppressed.

Structure Example 2

FIG. 9A is a plan view of the display panel, and FIG. 11A is an exampleof a cross-sectional view taken along the dashed-dotted line A1-A2 inFIG. 9A. The display panel in Structure Example 2 is a top-emissiondisplay panel using a color filter method, which differs from thedisplay panel in Structure Example 1. Here, only different points fromthose of Structure Example 1 are described and the description of thesame points as Structure Example 1 is omitted.

A display panel which can be used in a display device of one embodimentof the present invention is a display panel in which a plurality ofpixels and a plurality of auxiliary electrodes are provided in a displayportion, each pixel includes a light-emitting element and a transistor,the light-emitting element includes a lower electrode, an upperelectrode, and an EL layer between the lower electrode and the upperelectrode, and the auxiliary electrode is in contact with the upperelectrode between adjacent lower electrodes.

A display panel shown in FIG. 11A has a structure in which subpixels offour colors of R, G, B, and Y express one color. FIG. 11C shows anexample of the arrangement of the subpixels of R, G, B, and Y. Thecross-sectional view of the display portion 804 in FIG. 11A is takenalong the dashed-dotted line Z1-Z2 in FIG. 11C.

As in the display panel shown in FIG. 11A, the light-emitting element830 includes an optical adjustment layer 832 between the lower electrode831 and the EL layer 833. A light-transmitting conductive material ispreferably used for the optical adjustment layer 832. Owing to thecombination of the coloring layer and a microcavity structure utilizingthe optical adjustment layer, light with high color purity can beextracted from the display device of one embodiment of the presentinvention. The thickness of the optical adjustment layer may be varieddepending on the color of the sub-pixel. In FIG. 11A, an opticaladjustment layer 832R of the subpixel R and an optical adjustment layer832B of the subpixel B are shown.

The display panel in FIG. 11A includes a spacer 823 over the insulatinglayer 821. The spacer 823 can adjust the distance between the substrate701 and the substrate 711.

The display panel in FIG. 11A includes an overcoat 849 covering thecoloring layer 845 and the light-blocking layer 847. The space betweenthe light-emitting element 830 and the overcoat 849 is filled with theadhesive layer 822.

In the display panel that can be used in the display device of oneembodiment of the present invention, the transparent portion is adjacentto the display portion and provided along the sides of the displayportion. In particular, in the case where the size of the display panelis large, it is required that a region not overlapping with thetransparent portion include a contact region where an upper electrode(in this embodiment, the upper electrode 835) common to pixels in thedisplay portion is connected to a wiring in the vicinity of the displayportion supplied with a power supply voltage. In the case where aconductive layer forming the upper electrode has high electricresistance, there is a concern that luminance of light emitted from apixel apart from the contact region in the display portion be lowered bya voltage drop of the upper electrode.

The display panel shown in FIG. 11A includes, between pixels, anauxiliary electrode 860 for suppressing the voltage drop of the upperelectrode 835. The auxiliary electrode 860 is preferably formed ofconductive materials whose electric resistance is lower than that of theupper electrode 835.

The conductive layer forming the auxiliary electrode 860, the lowerelectrode 831, and the like are preferably formed at the same timebecause a process can be shortened. In FIG. 11A, the auxiliary electrode860 is formed of a conductive material of the lower electrode 831 and aconductive material of the optical adjustment layer 832.

Here, a method of forming the auxiliary electrode 860 will be described.FIGS. 11B and 11C show examples of a top view of sub-pixels R, G, B, andY in the display portion 804. FIG. 11B is a top view at the time offinishing the formation of the lower electrode 831. FIG. 11C is a topview at the time of finishing the formation of the optical adjustmentlayer 832, the insulating layer 821, and the spacer 823 after the stateshown in FIG. 11B. Note that components such as the transistor 820 whichare formed before the formation of the lower electrode 831 are not shownin FIGS. 11B and 11C.

The auxiliary electrode 860 can be provided so as to fill a spacebetween sub-pixels. For example, the auxiliary electrode 860 may beprovided in a net-like shape so as to surround the lower electrode 831in each sub-pixel, or may be provided in a plurality of lines (orstripes) in a space in one direction between adjacent lower electrodes831.

The auxiliary electrode 860 forming one line is preferably continuousbecause the electric resistance of the upper electrode 835 can befurther reduced. FIG. 11B shows an example in which a conductive layer860 a is provided in a line. Note that here, the conductive layer 860 ais formed of the conductive layer used for forming the lower electrode831.

The auxiliary electrode 860 is in contact with the upper electrode 835so as to be electrically connected to the upper electrode 835.Therefore, in the case where EL layers 833 are formed by a separatecoloring method, the EL layers 833 are not formed over the auxiliaryelectrode 860, and the upper electrode 835 is formed over the auxiliaryelectrode 860, whereby the auxiliary electrode 860 and the upperelectrode 835 can be in contact with each other.

In this embodiment, the EL layers 833 are formed also on the auxiliaryelectrode 860 because the EL layers 833 are formed without using aseparate coloring method. Therefore, a method for forming the upperelectrode 835 so that a part of a surface of the auxiliary electrode 860is not covered with the EL layer 833 and the part is covered with theupper electrode 835 is required.

FIG. 11D1 is an enlarged view of the auxiliary electrode 860. Theauxiliary electrode 860 has a stacked-layer structure of the conductivelayer 860 a and a conductive layer 860 b. In the structure, the area ofa bottom surface of the conductive layer 860 b is larger than the areaof a top surface of the conductive layer 860 a, and a part of theconductive layer 860 b extends beyond the conductive layer 860 a.

When the auxiliary electrode 860 has such a structure, the conductivelayer 860 b serves as eaves in forming the EL layer 833. Therefore, theEL layer 833 is not formed on a part of a side surface of the conductivelayer 860 a, so that the part of the side surface can be exposed.Furthermore, the upper electrode 835 is formed by a formation methodwhich has lower anisotropy than a formation method for forming the ELlayer 833. Thus, the upper electrode 835 can be formed on the sidesurface of the conductive layer 860 a, and the conductive layer 860 aand the upper electrode 835 can be in contact with each other.

Note that in a process of manufacturing the display panel, a film lowerthan the conductive layer 860 a might be etched in etching theconductive layer 860 a or the conductive layer 860 b. In the case wherea region in contact with an end portion of a lower surface of theconductive layer 860 a is etched in the film, the EL layer 833 is lesslikely to be formed on the side surface of the conductive layer 860 a informing the EL layer 833.

FIG. 11D2 is a cross-sectional view of the auxiliary electrode 860 inthe case where a part of an insulating layer 817 b in contact with theend portion of the lower surface of the conductive layer 860 a isetched. In this case, the voltage drop of the upper electrode 835 can besuppressed more effectively than in the case of FIG. 11D1.

In FIG. 11C, a portion which is surrounded by a dashed line and is nothatched is covered with the insulating layer 821. In other words,regions surrounded by a solid line except the spacer 823 (a part of theoptical adjustment layer 832 and a part of the conductive layer 860 b)coincide with opening portions formed in the insulating layer 821. Here,the conductive layer 860 b and the optical adjustment layer 832 areformed of the same conductive layer.

In FIG. 11C, the opening portion is formed in the insulating layer 821so that a part of the auxiliary electrode 860 between a plurality oflower electrodes 831 is exposed. The size of the opening portion can beadjusted as appropriate depending on the electric resistance of theupper electrode 835 and the area of the display portion 804. The widthof the auxiliary electrode 860, i.e., the length in a direction in whichpixels are adjacent to each other with the auxiliary electrode 860provided therebetween can be adjusted as appropriate depending on theelectric resistance of the upper electrode 835 and the area of thedisplay portion 804.

Described below is a method for checking whether the auxiliary electrode860 in the display panel performs its function, i.e., whether the sidesurface of the auxiliary electrode 860 is in contact with the upperelectrode 835 as shown in FIG. 11D1 or FIG. 11D2.

In the display portion 804, a wiring (hereinafter referred to as ameasurement wiring) electrically connected to the auxiliary electrodes860 extending in one direction in a stripe is connected to one terminal(hereinafter referred to as a terminal A) included in the FPC 808. Oneterminal included in the FPC 808 electrically connected to the upperelectrode 835 is referred to as a terminal B.

When an electric resistance value between the terminal A and theterminal B is greater than or equal to 100Ω and less than or equal to 10kΩ, the auxiliary electrode 860 can be regarded as being in contact withthe upper electrode 835 in the display portion 804. Note that the lowerlimit of the electric resistance value may vary depending on thematerials of the auxiliary electrode 860, the material of the upperelectrode 835, and a material and a length of the measurement wiring.

Correction circuits may be provided in pixels to suppress variation incurrent flowing in the light-emitting elements 830 in the pixels.Specifically, a plurality of transistors and/or a plurality ofcapacitors may be provided in each sub-pixel so that variation incurrent flowing in the transistors 820 each having a source electrode ora drain electrode connected to the lower electrode 831 through aconductive layer 856 is suppressed in different sub-pixels of the samecolor. The variation in current is due to variation in the thickness ofa semiconductor layer of the transistor 820 in some cases. For example,a transistor 870 and a capacitor 871 shown in FIG. 11A may have afunction of correcting variation in current flowing in the transistor820.

FIG. 12, FIGS. 13A and 13B, FIGS. 14A and 14B, FIGS. 15A and 15B, andFIGS. 16A and 16B show examples of a pixel circuit including theabove-described correction circuit.

A pixel circuit shown in FIG. 12 includes six transistors (transistorsM1 to M6), three capacitors (capacitors C1 to C3), and thelight-emitting element 830. A wiring S1, a wiring S2, and wirings G1 toG6 are electrically connected to the pixel circuit shown in FIG. 12.Note that as the transistors M1 to M6, for example, n-channeltransistors can be used.

For example, the wirings G1 to G4 shown in FIG. 12 are electricallyconnected to the scan line driver circuit in the operating circuitportion 806. For example, the wiring S1 shown in FIG. 12 is electricallyconnected to the signal line driver circuit in the operating circuitportion 806. For example, the wiring G5, the wiring G6, and the wiringS2 shown in FIG. 12 are electrically connected to a constant voltagesource.

For example, the transistor 820 in FIG. 11A can serve as the transistorM6. For example, the transistor 870 in FIG. 11A can serve as any one ofthe transistors M1 to M5. For example, the capacitor 871 in FIG. 11A canserve as any one of the capacitors C1 to C3.

A pixel circuit shown in FIG. 13A includes six transistors (M7 to M12),a capacitor C4, and the light-emitting element 830. The pixel circuitshown in FIG. 13A is electrically connected to wirings S3 and S4 andwirings G7 to G11. Note that as the transistors M7 to M12, for example,n-channel transistors can be used. Alternatively, p-channel transistors(M13 to M18) may be used instead of the transistors M7 to M12, as shownin FIG. 13B.

A pixel circuit shown in FIG. 14A has a structure in which a transistorM19 is added to the pixel circuit shown in FIG. 13A. The pixel circuitshown in FIG. 14A is electrically connected to wirings G12 and G13. Thewirings G11 and G12 may be electrically connected to each other. Notethat as the transistor M19, for example, an n-channel transistor can beused.

A pixel circuit shown in FIG. 14B has a structure in which a transistorM20 is added to the pixel circuit shown in FIG. 13B. The pixel circuitshown in FIG. 14B is electrically connected to the wirings G12 and G13.The wirings G11 and G12 may be electrically connected to each other.Note that as the transistor M20, for example, a p-channel transistor canbe used.

A pixel circuit shown in FIG. 15A includes six transistors (M21 to M26),the capacitor C4, and the light-emitting element 830. The pixel circuitshown in FIG. 15A is electrically connected to wirings S5 to S7 andwirings G14 to G16. The wirings G14 to G16 may be electrically connectedto each other. Note that as the transistors M21 to M26, for example,n-channel transistors can be used. Alternatively, p-channel transistors(M27 to M32) may be used instead of the transistors M21 to M26, as shownin FIG. 15B.

A pixel circuit shown in FIG. 16A includes two transistors (transistorsM33 and M34), two capacitors (capacitors C5 and C6), and thelight-emitting element 830. The pixel circuit shown in FIG. 16A iselectrically connected to wirings S8 to S9 and wirings G17 to G19. Withthe configuration of the pixel circuit shown in FIG. 16A, the pixelcircuit shown in FIG. 16A can be driven by a voltage inputting currentdriving method (also referred to as CVCC). Note that as the transistorsM33 and M34, for example, n-channel transistors can be used.Alternatively, p-channel transistors (M35 and M36) may be used insteadof the transistors M33 to M34, as shown in FIG. 16B.

Structure Example 3

FIG. 9B is a plan view of the display panel, and FIG. 17A is an exampleof a cross-sectional view taken along the dashed-dotted line A3-A4 inFIG. 9B. The display panel in Structure Example 3 is a top-emissiondisplay device using a separate coloring method.

The display panel in FIG. 17A includes the substrate 701, the adhesivelayer 703, the insulating layer 705, a plurality of transistors, theconductive layer 857, the insulating layer 815, the insulating layer817, a plurality of light-emitting elements, the insulating layer 821,the spacer 823, the adhesive layer 822, the insulating layer 715, andthe substrate 711. The adhesive layer 822, the insulating layer 715, andthe substrate 711 transmit visible light.

In the display panel in FIG. 17A, the connector 825 is positioned overthe insulating layer 815. The connector 825 is connected to theconductive layer 857 through an opening provided in the insulating layer815. Moreover, the connector 825 is connected to the FPC 808. The FPC808 and the conductive layer 857 are electrically connected to eachother with the connector 825 provided therebetween.

Structure Example 4

FIG. 9B is a plan view of the display panel, and FIG. 17B is an exampleof a cross-sectional view taken along the dashed-dotted line A3-A4 inFIG. 9B. The display panel in Structure Example 4 is a bottom-emissiondisplay panel using a color filter method.

The display panel in FIG. 17B includes the substrate 701, the adhesivelayer 703, the insulating layer 705, a plurality of transistors, theconductive layer 857, the insulating layer 815, the coloring layer 845,the insulating layer 817 a, the insulating layer 817 b, the conductivelayer 856, a plurality of light-emitting elements, the insulating layer821, the adhesive layer 822, and the substrate 711. The substrate 701,the adhesive layer 703, the insulating layer 705, the insulating layer815, the insulating layer 817 a, and the insulating layer 817 b transmitvisible light.

The display portion 804 includes the transistor 820, the transistor 824,and the light-emitting element 830 over the insulating layer 705. Thelight-emitting element 830 includes the lower electrode 831 over theinsulating layer 817 b, the EL layer 833 over the lower electrode 831,and the upper electrode 835 over the EL layer 833. The lower electrode831 is electrically connected to a source electrode or a drain electrodeof the transistor 820. An end portion of the lower electrode 831 iscovered with the insulating layer 821. The upper electrode 835preferably reflects visible light. The lower electrode 831 transmitsvisible light. The coloring layer 845 that overlaps with thelight-emitting element 830 can be provided anywhere; for example, thecoloring layer 845 may be provided between the insulating layers 817 aand 817 b or between the insulating layers 815 and 817 a.

In the operating circuit portion 806, a plurality of transistors areprovided over the substrate 701 with the adhesive layer 703 and theinsulating layer 705 provided therebetween. In FIG. 17B, two of thetransistors included in the operating circuit portion 806 isillustrated.

The insulating layer 705 is preferably highly resistant to moisture, inwhich case impurities such as water can be prevented from entering thelight-emitting element 830, the transistor 820, or the transistor 824,leading to higher reliability of the display panel.

The conductive layer 857 is electrically connected to an externalelectrode through which a signal or a potential from the outside istransmitted to the operating circuit portion 806. Here, an example inwhich the FPC 808 is provided as the external electrode is described.Here, an example is described in which the conductive layer 857 isformed using the same material and the same step(s) as those of theconductive layer 856.

Examples of Materials and Formation Method

Next, materials and the like that can be used for the display panel orthe light-emitting panel are described. Note that description of thecomponents already described in this specification and the like isomitted in some cases.

For each of the substrates, a material such as glass, quartz, an organicresin, a metal, or an alloy can be used. The substrate through whichlight is extracted from the light-emitting element is formed using amaterial which transmits the light.

In particular, a flexible substrate is preferably used. For example, anorganic resin; or glass, a metal, or an alloy that is thin enough tohave flexibility can be used.

An organic resin, which has a specific gravity smaller than that ofglass, is preferably used for the flexible substrate, in which case thedisplay panel can be lightweight as compared with the case where glassis used.

The substrate is preferably formed using a material with high toughness.In that case, a display panel with high impact resistance that is lesslikely to be broken can be provided. For example, when an organic resinsubstrate or a thin metal or alloy substrate is used, the display panelcan be lightweight and unlikely to be broken as compared with the casewhere a glass substrate is used.

A metal material and an alloy material, which have high thermalconductivity, are preferable because they can easily conduct heat to thewhole substrate and accordingly can prevent a local temperature rise inthe display panel. The thickness of a substrate using a metal materialor an alloy material is preferably greater than or equal to 10 μm andless than or equal to 200 μm, further preferably greater than or equalto 20 μm and less than or equal to 50 μm.

There is no particular limitation on a material of the metal substrateor the alloy substrate, but it is preferable to use, for example,aluminum, copper, nickel, or a metal alloy such as an aluminum alloy orstainless steel.

Furthermore, when a material with high thermal emissivity is used forthe substrate, the surface temperature of the display panel can beprevented from rising, leading to inhibition of breakage or a decreasein reliability of the display panel. For example, the substrate may havea stacked-layer structure of a metal substrate and a layer with highthermal emissivity (the layer can be formed using a metal oxide or aceramic material, for example).

As the substrate having flexibility and a light-transmitting property, aplastic substrate that is formed as a film, for example, a plasticsubstrate made from polyimide (PI), an aramid, polyethyleneterephthalate (PET), polyethersulfone (PES), polyethylene naphthalate(PEN), polycarbonate (PC), nylon, polyetheretherketone (PEEK),polysulfone (PSF), polyetherimide (PEI), polyarylate (PAR), polybutyleneterephthalate (PBT), a silicone resin, and the like, or a glasssubstrate can be used. The substrate may include a fiber or the like(e.g., a prepreg). Furthermore, the substrate is not limited to theresin film, and a transparent nonwoven fabric formed by processing pulpinto a continuous sheet, a sheet including an artificial spider's threadfiber containing protein called fibroin, a complex in which thetransparent nonwoven fabric or the sheet and a resin are mixed, a stackof a resin film and a nonwoven fabric containing a cellulose fiber whosefiber width is 4 nm or more and 100 nm or less, or a stack of a resinfilm and a sheet including an artificial spider's thread fiber may beused.

The flexible substrate may have a stacked-layer structure in which ahard coat layer (e.g., a silicon nitride layer) by which a surface ofthe device is protected from damage, a layer which can disperse pressure(e.g., an aramid resin layer), or the like is stacked over a layer ofany of the above-mentioned materials.

The flexible substrate may be formed by stacking a plurality of layers.When a glass layer is used, a barrier property against water and oxygencan be improved and thus a highly reliable display panel can beprovided.

For example, a flexible substrate in which a glass layer, an adhesivelayer, and an organic resin layer are stacked from the side closer to alight-emitting element can be used. The thickness of the glass layer isgreater than or equal to 20 μm and less than or equal to 200 μm,preferably greater than or equal to 25 μm and less than or equal to 100μm. With such a thickness, the glass layer can have both a high barrierproperty against water and oxygen and high flexibility. The thickness ofthe organic resin layer is greater than or equal to 10 μm and less thanor equal to 200 μm, preferably greater than or equal to 20 μm and lessthan or equal to 50 μm. By providing such an organic resin layer outsidethe glass layer, occurrence of a crack or a break in the glass layer canbe inhibited and mechanical strength can be improved. With the substratethat includes such a composite material of a glass material and anorganic resin, a highly reliable flexible display panel can be provided.

Here, a method for forming a flexible display panel is described.

For convenience, a structure including a pixel and a driver circuit, astructure including an optical member such as a color filter, astructure including a touch sensor, or a structure including afunctional member is referred to as an element layer. An element layerincludes a display element, for example, and may include a wiringelectrically connected to a display element or an element such as atransistor used in a pixel or a circuit in addition to the displayelement.

Here, a support provided with an insulating surface over which anelement layer is formed is called a base material.

As a method for forming an element layer over a flexible base material,there are a method in which an element layer is formed directly over abase material, and a method in which an element layer is formed over asupporting base material that is different from the base material andhas stiffness and then the element layer is separated from thesupporting base material and transferred to the base material.

In the case where a material of the base material can withstand heatingtemperature in the process for forming the element layer, it ispreferred that the element layer be formed directly over the basematerial, in which case a manufacturing process can be simplified. Atthis time, the element layer is preferably formed in a state where thebase material is fixed to the supporting base material, in which casethe transfer of the element layer in a device and between devices can beeasy.

In the case of employing the method in which the element layer is formedover the supporting base material and then transferred to the basematerial, first, a separation layer and an insulating layer are stackedover a supporting base material, and then the element layer is formedover the insulating layer. Then, the element layer is separated from thesupporting base material and then transferred to the base material. Atthis time, a material is selected such that separation at an interfacebetween the supporting base material and the separation layer, at aninterface between the separation layer and the insulating layer, or inthe separation layer occurs. With such a method, the element layer canbe formed at temperatures higher than the upper temperature limit of thebase material, which improves the reliability of the display panel.

For example, it is preferable that stacked layers of a layer including ahigh-melting-point metal material, such as tungsten, and a layerincluding an oxide of the metal material be used as the separationlayer, and stacked layers of a plurality of layers as the insulatinglayer, such as a silicon nitride layer and a silicon oxynitride layer beused over the separation layer. By using a high-melting-point metalmaterial, a high-temperature process can be performed to form theelement layer, resulting in high reliability. For example, impuritiescontained in the element layer can be further reduced, and thecrystallinity of a semiconductor or the like included in the elementlayer can be further increased. For the base material, any of the aboveflexible materials can be preferably used.

Examples of the separation include peeling off by application ofmechanical power, removal of the separation layer by etching, orseparation by dripping of a liquid into part of the separation interfaceto penetrate the entire separation interface.

The separation layer is not necessarily provided in the case whereseparation can occur at an interface between the supporting basematerial and the insulating layer. For example, glass may be used as thesupporting base material, an organic resin such as polyimide may be usedas the insulating layer, a separation trigger may be formed by locallyheating part of the organic resin by laser light or the like, andseparation may be performed at an interface between the glass and theinsulating layer. Alternatively, it is possible that a layer containinga material with high thermal conductivity (e.g., a metal or asemiconductor) is provided between the supporting base material and theinsulating layer containing an organic resin, and this layer is heatedby current so that separation easily occurs, and then separation isperformed. In this case, the insulating layer containing an organicresin can also be used as the base material.

As the adhesive layer, a variety of curable resins such as a reactivecurable resin, a thermosetting resin, an anaerobic resin, and a photocurable resin such as an ultraviolet curable resin can be used. Examplesof such resins include an epoxy resin, an acrylic resin, a siliconeresin, a phenol resin, a polyimide resin, an imide resin, a polyvinylchloride (PVC) resin, a polyvinyl butyral (PVB) resin, an ethylene vinylacetate (EVA) resin, and the like. In particular, a material with lowmoisture permeability, such as an epoxy resin, is preferable.Alternatively, a two-component-mixture-type resin may be used. Furtheralternatively, an adhesive sheet or the like may be used.

Furthermore, the resin may include a drying agent. For example, asubstance which adsorbs moisture by chemical adsorption, such as anoxide of an alkaline earth metal (e.g., calcium oxide or barium oxide),can be used. Alternatively, a substance that adsorbs moisture byphysical adsorption, such as zeolite or silica gel, may be used. Thedrying agent is preferably included, in which case entry of impuritiessuch as moisture into the light-emitting element can be inhibited andthe reliability of the display panel can be improved.

In addition, a filler with a high refractive index or a light scatteringmember is mixed into the resin, in which case the efficiency of lightextraction from the light-emitting element can be improved. For example,titanium oxide, barium oxide, zeolite, zirconium, or the like can beused.

Insulating films with high resistance to moisture are preferably usedfor the insulating layer 705 and the insulating layer 715.Alternatively, the insulating layer 705 and the insulating layer 715preferably have a function of preventing diffusion of impurities to alight-emitting element.

As an insulating film having an excellent moisture-proof property, afilm containing nitrogen and silicon (e.g., a silicon nitride film or asilicon nitride oxide film), a film containing nitrogen and aluminum(e.g., an aluminum nitride film), or the like can be used.Alternatively, a silicon oxide film, a silicon oxynitride film, analuminum oxide film, or the like can be used.

For example, the water vapor transmittance of the insulating film havingan excellent moisture-proof property is lower than or equal to 1×10⁻⁵[g/(m²·day)], preferably lower than or equal to 1×10⁻⁶ [g/(m²·day)],further preferably lower than or equal to 1×10⁻⁷ [g/(m²·day)], stillfurther preferably lower than or equal to 1×10⁻⁸ [g/(m²·day)].

In the display panel, it is necessary that at least one of theinsulating layers 705 and 715, which is on the light-emitting surfaceside, transmit light emitted from the light-emitting element. In thecase where the display panel includes the insulating layers 705 and 715,one of the insulating layers 705 and 715, which transmits light emittedfrom the light-emitting element, preferably has higher averagetransmittance than the other in a wavelength of 400 nm or more and 800nm or less.

The insulating layers 705 and 715 each preferably include oxygen,nitrogen, and silicon. The insulating layers 705 and 715 each preferablyinclude, for example, silicon oxynitride. Moreover, the insulatinglayers 705 and 715 each preferably include silicon nitride or siliconnitride oxide. It is preferable that the insulating layers 705 and 715be each formed using a silicon oxynitride film and a silicon nitridefilm, which are in contact with each other. The silicon oxynitride filmand the silicon nitride film are alternately stacked so that antiphaseinterference occurs more often in a visible region, whereby the stackcan have higher transmittance of light in the visible region.

There is no particular limitation on the structure of the transistor inthe display panel. For example, a forward staggered transistor or aninverted staggered transistor may be used. Furthermore, a top-gatetransistor or a bottom-gate transistor may be used. A semiconductormaterial used for the transistors is not particularly limited, and forexample, silicon, germanium, or an organic semiconductor can be used.Alternatively, an oxide semiconductor containing at least one of indium,gallium, and zinc, such as an In—Ga—Zn-based metal oxide, may be used.

There is no particular limitation on the crystallinity of asemiconductor material used for the transistors, and an amorphoussemiconductor or a semiconductor having crystallinity (amicrocrystalline semiconductor, a polycrystalline semiconductor, asingle-crystal semiconductor, or a semiconductor partly includingcrystal regions) may be used. It is preferable that a semiconductorhaving crystallinity be used, in which case deterioration of thetransistor characteristics can be inhibited.

For stable characteristics of the transistor, a base film is preferablyprovided. The base film can be formed to have a single-layer structureor a stacked-layer structure using an inorganic insulating film such asa silicon oxide film, a silicon nitride film, a silicon oxynitride film,or a silicon nitride oxide film. The base film can be formed by asputtering method, a chemical vapor deposition (CVD) method (e.g., aplasma CVD method, a thermal CVD method, or a metal organic CVD (MOCVD)method), an atomic layer deposition (ALD) method, a coating method, aprinting method, or the like. Note that the base film is not necessarilyprovided. In each of the above structure examples, the insulating layer705 can serve as a base film of the transistor.

As the light-emitting element, a self-luminous element can be used, andan element whose luminance is controlled by current or voltage isincluded in the category of the light-emitting element. For example, alight-emitting diode (LED), an organic EL element, an inorganic ELelement, or the like can be used.

The light-emitting element may have any of a top emission structure, abottom emission structure, and a dual emission structure. A conductivefilm that transmits visible light is used as the electrode through whichlight is extracted. A conductive film that reflects visible light ispreferably used as the electrode through which light is not extracted.

The conductive film that transmits visible light can be formed using,for example, indium oxide, indium tin oxide (ITO), indium zinc oxide,zinc oxide (ZnO), or zinc oxide to which gallium is added.Alternatively, a film of a metal material such as gold, silver,platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron,cobalt, copper, palladium, or titanium; an alloy containing any of thesemetal materials; a nitride of any of these metal materials (e.g.,titanium nitride); or the like can be formed thin so as to transmitlight. Alternatively, a stacked film of any of the above materials canbe used as the conductive layer. For example, a stacked film of ITO andan alloy of silver and magnesium is preferably used, in which caseconductivity can be increased. Further alternatively, graphene or thelike may be used.

For the conductive film that reflects visible light, for example, ametal material, such as aluminum, gold, platinum, silver, nickel,tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium or analloy including any of these metal materials can be used. Lanthanum,neodymium, germanium, or the like may be added to the metal material orthe alloy. Furthermore, an alloy containing aluminum (an aluminum alloy)such as an alloy of aluminum and titanium, an alloy of aluminum andnickel, an alloy of aluminum and neodymium, or an alloy of aluminum,nickel, and lanthanum (Al—Ni—La), or an alloy containing silver such asan alloy of silver and copper, an alloy of silver, palladium, and copper(Ag—Pd—Cu, also referred to as APC), or an alloy of silver and magnesiumcan be used for the conductive film. An alloy of silver and copper ispreferable because of its high heat resistance. Moreover, a metal filmor a metal oxide film is stacked on an aluminum alloy film, wherebyoxidation of the aluminum alloy film can be suppressed. Examples of amaterial for the metal film or the metal oxide film are titanium andtitanium oxide. Alternatively, the conductive film having a property oftransmitting visible light and a film containing any of the above metalmaterials may be stacked. For example, a stacked film of silver and ITOor a stacked film of an alloy of silver and magnesium and ITO can beused.

The lower electrode 831, the upper electrode 835, and the conductivelayers forming the auxiliary electrode 860 (the conductive layers 860 aand 860 b) can be formed of the conductive film that transmits visiblelight or the conductive film that reflects visible light.

The electrodes may be formed separately by an evaporation method or asputtering method. Alternatively, a discharging method such as anink-jet method, a printing method such as a screen printing method, or aplating method may be used.

When a voltage higher than the threshold voltage of the light-emittingelement is applied between the lower electrode 831 and the upperelectrode 835, holes are injected to the EL layer 833 from the anodeside and electrons are injected to the EL layer 833 from the cathodeside. The injected electrons and holes are recombined in the EL layer833 and a light-emitting substance contained in the EL layer 833 emitslight.

The EL layer 833 includes at least a light-emitting layer. In additionto the light-emitting layer, the EL layer 833 may further include one ormore layers containing any of a substance with a high hole-injectionproperty, a substance with a high hole-transport property, ahole-blocking material, a substance with a high electron-transportproperty, a substance with a high electron-injection property, asubstance with a bipolar property (a substance with a high electron- andhole-transport property), and the like.

For the EL layer 833, either a low molecular compound or a highmolecular compound can be used, and an inorganic compound may also beused. Each of the layers included in the EL layer 833 can be formed byany of the following methods: an evaporation method (including a vacuumevaporation method), a transfer method, a printing method, an inkjetmethod, a coating method, and the like.

The light-emitting element 830 may contain two or more kinds oflight-emitting substances. Thus, for example, a light-emitting elementthat emits white light can be achieved. For example, a white emissioncan be obtained by selecting light-emitting substances so that two ormore kinds of light-emitting substances emit light of complementarycolors. A light-emitting substance that emits red (R) light, green (G)light, blue (B) light, yellow (Y) light, or orange (O) light or alight-emitting substance that emits light containing spectral componentsof two or more of R light, G light, and B light can be used, forexample. A light-emitting substance that emits blue light and alight-emitting substance that emits yellow light may be used, forexample. At this time, the emission spectrum of the light-emittingsubstance that emits yellow light preferably contains spectralcomponents of G light and R light. The emission spectrum of thelight-emitting element 830 preferably has two or more peaks in thewavelength range in a visible region (e.g., greater than or equal to 350nm and less than or equal to 750 nm or greater than or equal to 400 nmand less than or equal to 800 nm).

The EL layer 833 may include a plurality of light-emitting layers. Inthe EL layer 833, the plurality of light-emitting layers may be stackedin contact with one another or may be stacked with a separation layerprovided therebetween. The separation layer may be provided between afluorescent layer and a phosphorescent layer, for example.

The separation layer can be provided, for example, to prevent energytransfer by the Dexter mechanism (particularly triplet energy transfer)from a phosphorescent material or the like in an excited state which isgenerated in the phosphorescent layer to a fluorescent material or thelike in the fluorescent layer. The thickness of the separation layer maybe several nanometers. Specifically, the thickness of the separationlayer may be greater than or equal to 0.1 nm and less than or equal to20 nm, greater than or equal to 1 nm and less than or equal to 10 nm, orgreater than or equal to 1 nm and less than or equal to 5 nm. Theseparation layer contains a single material (preferably, a bipolarsubstance) or a plurality of materials (preferably, a hole-transportmaterial and an electron-transport material).

The separation layer may be formed using a material contained in alight-emitting layer in contact with the separation layer. Thisfacilitates the manufacture of the light-emitting element and reducesthe drive voltage. For example, in the case where the phosphorescentlayer includes a host material, an assist material, and a phosphorescentmaterial (guest material), the separation layer may be formed using thehost material and the assist material. In other words, the separationlayer includes a region not containing the phosphorescent material andthe phosphorescent layer includes a region containing the phosphorescentmaterial in the above structure. Accordingly, the separation layer andthe phosphorescent layer can be evaporated separately depending onwhether a phosphorescent material is used or not. With such a structure,the separation layer and the phosphorescent layer can be formed in thesame chamber. Thus, the manufacturing costs can be reduced.

Moreover, the light-emitting element 830 may be a single elementincluding one EL layer or a tandem element in which EL layers arestacked with a charge generation layer provided therebetween.

The light-emitting element is preferably provided between a pair ofinsulating films having an excellent moisture-proof property. In thatcase, entry of an impurity such as moisture into the light-emittingelement can be inhibited, leading to inhibition of a decrease in thereliability of the display panel.

As the insulating layer 815 and the insulating layer 816, for example,an inorganic insulating film such as a silicon oxide film, a siliconoxynitride film, or an aluminum oxide film can be used. Note that theinsulating layer 815 and the insulating layer 816 may be formed usingdifferent materials. As the insulating layer 817, the insulating layer817 a, and the insulating layer 817 b, an organic material such aspolyimide, acrylic, polyamide, polyimide amide, or abenzocyclobutene-based resin can be used, for example. Alternatively, alow-dielectric constant material (a low-k material) or the like can beused. Furthermore, each insulating layer may be formed by stacking aplurality of insulating films.

The insulating layer 821 is formed using an organic insulating materialor an inorganic insulating material. As the resin, for example, apolyimide resin, a polyamide resin, an acrylic resin, a siloxane resin,an epoxy resin, or a phenol resin can be used. It is particularlypreferable that the insulating layer 821 be formed using aphotosensitive resin material to have an opening portion over the lowerelectrode 831 so that a side wall of the opening portion is formed as aninclined surface with a continuous curvature.

There is no particular limitation on the method for forming theinsulating layer 821; a photolithography method, a sputtering method, anevaporation method, a droplet discharging method (e.g., an inkjetmethod), a printing method (e.g., a screen printing method or an off-setprinting method), or the like may be used.

The spacer 823 can be formed using an inorganic insulating material, anorganic insulating material, a metal material, or the like. As theinorganic insulating material and the organic insulating material, forexample, a variety of materials that can be used for the insulatinglayer can be used. As the metal material, titanium, aluminum, or thelike can be used. When the spacer 823 containing a conductive materialis electrically connected to the upper electrode 835, a potential dropdue to the resistance of the upper electrode 835 can be inhibited. Thespacer 823 may have either a tapered shape or an inverse tapered shape.

For example, a conductive layer functioning as an electrode or a wiringof the transistor, an auxiliary electrode of the light-emitting element,or the like, which is used for the display panel, can be formed to havea single-layer structure or a stacked-layer structure using any of metalmaterials such as molybdenum, titanium, chromium, tantalum, tungsten,aluminum, copper, neodymium, and scandium, and an alloy materialcontaining any of these elements. Alternatively, the conductive layermay be formed using a conductive metal oxide. As the conductive metaloxide, indium oxide (e.g., In₂O₃), tin oxide (e.g., SnO₂), ZnO, ITO,indium zinc oxide (e.g., In₂O₃—ZnO), or any of these metal oxidematerials in which silicon oxide is contained can be used.

The coloring layer is a colored layer that transmits light in a specificwavelength range. For example, a color filter for transmitting light ina red, green, blue, or yellow wavelength range can be used. Eachcoloring layer is formed in a desired position with any of variousmaterials by a printing method, an inkjet method, an etching methodusing a photolithography method, or the like. In a white sub-pixel, aresin such as a transparent resin or a white resin may be provided so asto overlap with the light-emitting element.

The light-blocking layer is provided between the adjacent coloringlayers. The light-blocking layer blocks light emitted from an adjacentlight-emitting element to inhibit color mixture between adjacentlight-emitting elements. Here, the coloring layer is provided such thatits end portion overlaps with the light-blocking layer, whereby lightleakage can be reduced. As the light-blocking layer, a material that canblock light from the light-emitting element can be used; for example, ablack matrix is formed using a resin material containing a metalmaterial, pigment, or dye. Note that it is preferable to provide thelight-blocking layer in a region other than the display portion, such asa driver circuit portion, in which case undesired leakage of guidedlight or the like can be inhibited.

Furthermore, an overcoat covering the coloring layer and thelight-blocking layer may be provided. The overcoat can prevent animpurity and the like contained in the coloring layer from beingdiffused into the light-emitting element. The overcoat is formed with amaterial that transmits light emitted from the light-emitting element;for example, an inorganic insulating film such as a silicon nitride filmor a silicon oxide film, an organic insulating film such as an acrylicfilm or a polyimide film can be used, and further, a stacked-layerstructure of an organic insulating film and an inorganic insulating filmmay be employed.

In the case where upper surfaces of the coloring layer and thelight-blocking layer are coated with a material of the adhesive layer, amaterial which has high wettability with respect to the material of theadhesive layer is preferably used as the material of the overcoat. Forexample, an oxide conductive film such as an ITO film or a metal filmsuch as an Ag film which is thin enough to transmit light is preferablyused as the overcoat.

As the connector, any of a variety of anisotropic conductive films(ACF), anisotropic conductive pastes (ACP), and the like can be used.

In this specification and the like, a display element, a display panelwhich is a panel including a display element, a light-emitting element,and a light-emitting panel which is a panel including a light-emittingelement can employ various modes or can include various elements. Adisplay element, a display panel, a light-emitting element, or alight-emitting panel may include a display medium whose contrast,luminance, reflectivity, transmittance, or the like is changed byelectrical or magnetic effect, such as an EL element (e.g., an ELelement including organic and inorganic materials, an organic ELelement, or an inorganic EL element), an LED (e.g., a white LED, a redLED, a green LED, or a blue LED), a transistor (a transistor which emitslight depending on current), an electron emitter, a liquid crystalelement, electronic ink, an electrophoretic element, a grating lightvalve (GLV), a plasma display panel (PDP), a display element includingmicro electro mechanical systems (MEMS), a digital micromirror device(DMD), a digital micro shutter (DMS), an interferometric modulatordisplay (IMOD) element, an MEMS shutter display element, opticalinterference type MEMS display element, an electrowetting element, apiezoelectric ceramic display, and a display element including a carbonnanotube. Note that examples of a display panel having an EL elementinclude an EL display. Examples of a display panel having an electronemitter include a field emission display (FED) and an SED-type flatpanel display (SED: surface-conduction electron-emitter display).Examples of a display panel having a liquid crystal element include aliquid crystal display (e.g., a transmissive liquid crystal display, atransflective liquid crystal display, a reflective liquid crystaldisplay, a direct-view liquid crystal display, or a projection liquidcrystal display). Examples of a display panel having electronic ink,ELECTRONIC LIQUID POWDER (registered trademark), or an electrophoreticelement include electronic paper. In the case of a transflective liquidcrystal display or a reflective liquid crystal display, some of or allof pixel electrodes function as reflective electrodes. For example, someor all of pixel electrodes are formed to contain aluminum or silver.Furthermore, in such a case, a memory circuit such as an SRAM can beprovided under the reflective electrodes, leading to lower powerconsumption. Note that in the case of using an LED, graphene or graphitemay be provided under an electrode or a nitride semiconductor of theLED. Graphene or graphite may be a multilayer film in which a pluralityof layers are stacked. As described above, provision of graphene orgraphite enables easy formation of a nitride semiconductor filmthereover, such as an n-type GaN semiconductor layer including crystals.Furthermore, a p-type GaN semiconductor layer including crystals or thelike can be provided thereover, and thus the LED can be formed. Notethat an AlN layer may be provided between the n-type GaN semiconductorlayer including crystals and graphene or graphite. The GaN semiconductorlayers included in the LED may be formed by MOCVD. Note that when thegraphene is provided, the GaN semiconductor layers included in the LEDcan also be formed by a sputtering method.

For example, in this specification and the like, an active matrix methodin which an active element (a non-linear element) is included in a pixelor a passive matrix method in which an active element is not included ina pixel can be used.

In the active matrix method, not only a transistor but also a variety ofactive elements can be used. For example, an MIM (metal insulatormetal), a TFD (thin film diode), or the like can also be used. Sincesuch an element has few numbers of manufacturing steps, manufacturingcost can be reduced or yield can be improved. Alternatively, since thesize of these elements is small, the aperture ratio can be improved, sothat power consumption can be reduced or higher luminance can beachieved.

Since an active element is not used in the passive matrix method, thenumber of manufacturing steps can be reduced, so that manufacturing costcan be reduced or the yield can be improved. Alternatively, since anactive element is not used in the passive matrix method, the apertureratio can be improved, so that power consumption can be reduced orhigher luminance can be achieved, for example.

Note that the light-emitting panel of one embodiment of the presentinvention may be used as a display panel or as a lighting panel. Forexample, it may be used as a light source such as a backlight or a frontlight, that is, a lighting panel for a display panel.

As described above, by using the display panel including the transparentportion described as an example in this embodiment, a large-sizeddisplay device in which a joint portion of the display portions ishardly seen and display unevenness is reduced can be obtained.

This embodiment can be combined with any other embodiment asappropriate.

Embodiment 3

In this embodiment, a touch panel that can be used in a display deviceof one embodiment of the present invention will be described withreference to drawings. Note that the above description can be referredto for the components of the touch panel, which are similar to those ofthe display panel described in Embodiment 2. Although a touch panelincluding a light-emitting element is described as an example in thisembodiment, one embodiment of the present invention is not limitedthereto. For example, a touch panel including another element (e.g., adisplay element), the example of which is shown in Embodiment 2, canalso be used in the display device of one embodiment of the presentinvention.

Structure Example 1

FIG. 18A is a top view of the touch panel. FIG. 18B is a cross-sectionalview taken along the dashed-dotted line A-B and the dashed-dotted lineC-D in FIG. 18A. FIG. 18C is a cross-sectional view taken along thedashed-dotted line E-F in FIG. 18A.

A touch panel 390 illustrated in FIG. 18A includes a display portion 301(serving also as an input portion), a scan line driver circuit 303 g(1),an imaging pixel driver circuit 303 g(2), an image signal line drivercircuit 303 s(1), and an imaging signal line driver circuit 303 s(2).

The display portion 301 includes a plurality of pixels 302 and aplurality of imaging pixels 308.

The pixel 302 includes a plurality of sub-pixels. Each sub-pixelincludes a light-emitting element and a pixel circuit.

The pixel circuits can supply electric power for driving thelight-emitting element. The pixel circuits are electrically connected towirings through which selection signals are supplied. The pixel circuitsare also electrically connected to wirings through which image signalsare supplied.

The scan line driver circuit 303 g(1) can supply selection signals tothe pixels 302.

The image signal line driver circuit 303 s(1) can supply image signalsto the pixels 302.

A touch sensor can be formed using the imaging pixels 308. Specifically,the imaging pixels 308 can sense a touch of a finger or the like on thedisplay portion 301.

The imaging pixels 308 include photoelectric conversion elements andimaging pixel circuits.

The imaging pixel circuits can drive photoelectric conversion elements.The imaging pixel circuits are electrically connected to wirings throughwhich control signals are supplied. The imaging pixel circuits are alsoelectrically connected to wirings through which power supply potentialsare supplied.

Examples of the control signal include a signal for selecting an imagingpixel circuit from which a recorded imaging signal is read, a signal forinitializing an imaging pixel circuit, and a signal for determining thetime it takes for an imaging pixel circuit to sense light.

The imaging pixel driver circuit 303 g(2) can supply control signals tothe imaging pixels 308.

The imaging signal line driver circuit 303 s(2) can read out imagingsignals.

As illustrated in FIGS. 18B and 18C, the touch panel 390 includes thesubstrate 701, the adhesive layer 703, the insulating layer 705, thesubstrate 711, the adhesive layer 713, and the insulating layer 715. Thesubstrates 701 and 711 are bonded to each other with an adhesive layer360.

The substrate 701 and the insulating layer 705 are bonded to each otherwith the adhesive layer 703. The substrate 711 and the insulating layer715 are bonded to each other with the adhesive layer 713.

The substrates 701 and 711 are preferably flexible.

Embodiment 2 can be referred to for materials used for the substrates,the adhesive layers, and the insulating layers.

Each of the pixels 302 includes the sub-pixel 302R, a sub-pixel 302G,and a sub-pixel 302B (see FIG. 18C). The sub-pixel 302R includes alight-emitting module 380R, the sub-pixel 302G includes a light-emittingmodule 380G, and the sub-pixel 302B includes a light-emitting module380B.

For example, the sub-pixel 302R includes the light-emitting element 350Rand the pixel circuit. The pixel circuit includes a transistor 302 tthat can supply electric power to the light-emitting element 350R.Furthermore, the light-emitting module 380R includes the light-emittingelement 350R and an optical element (e.g., a coloring layer 367R thattransmits red light).

The light-emitting element 350R includes a lower electrode 351R, an ELlayer 353, and an upper electrode 352, which are stacked in this order(see FIG. 18C).

The EL layer 353 includes a first EL layer 353 a, an intermediate layer354, and a second EL layer 353 b, which are stacked in this order.

Note that a microcavity structure can be provided for the light-emittingmodule 380R so that light with a specific wavelength can be efficientlyextracted. Specifically, an EL layer may be provided between a film thatreflects visible light and a film that partly reflects and partlytransmits visible light, which are provided so that light with aspecific wavelength can be efficiently extracted.

The light-emitting module 380R, for example, includes the adhesive layer360 that is in contact with the light-emitting element 350R and thecoloring layer 367R.

The coloring layer 367R is positioned in a region overlapping with thelight-emitting element 350R. Accordingly, part of light emitted from thelight-emitting element 350R passes through the adhesive layer 360 andthe coloring layer 367R and is emitted to the outside of thelight-emitting module 380R as indicated by an arrow in FIG. 18B or 18C.

The touch panel 390 includes a light-blocking layer 367BM. Thelight-blocking layer 367BM is provided so as to surround the coloringlayer (e.g., the coloring layer 367R).

The touch panel 390 includes an anti-reflective layer 367 p positionedin a region overlapping with the display portion 301. As theanti-reflective layer 367 p, a circular polarizing plate can be used,for example.

The touch panel 390 includes an insulating layer 321. The insulatinglayer 321 covers the transistor 302 t and the like. Note that theinsulating layer 321 can be used as a layer for covering unevennesscaused by the pixel circuits and the imaging pixel circuits. Aninsulating layer on which a layer that can inhibit diffusion ofimpurities to the transistor 302 t and the like is stacked can be usedas the insulating layer 321.

The touch panel 390 includes a partition 328 that overlaps with an endportion of the lower electrode 351R. In addition, a spacer 329 thatcontrols the distance between the substrate 701 and the substrate 711 isprovided on the partition 328.

The image signal line driver circuit 303 s(1) includes a transistor 303t and a capacitor 303 c. Note that the driver circuit can be formed inthe same process and over the same substrate as those of the pixelcircuits. As illustrated in FIG. 18B, the transistor 303 t may include asecond gate 304 over the insulating layer 321. The second gate 304 maybe electrically connected to a gate of the transistor 303 t, ordifferent potentials may be supplied to these gates. Alternatively, ifnecessary, the second gate 304 may be provided for a transistor 308 t,the transistor 302 t, or the like.

The imaging pixels 308 each include a photoelectric conversion element308 p and an imaging pixel circuit. The imaging pixel circuit can senselight received by the photoelectric conversion element 308 p. Theimaging pixel circuit includes the transistor 308 t.

For example, a PIN photodiode can be used as the photoelectricconversion element 308 p.

The touch panel 390 includes a wiring 311 through which a signal issupplied. The wiring 311 is provided with a terminal 319. Note that anFPC 309 through which a signal such as an image signal or asynchronization signal is supplied is electrically connected to theterminal 319. Note that a printed wiring board (PWB) may be attached tothe FPC 309.

Note that transistors such as the transistors 302 t, 303 t, and 308 tcan be formed in the same process. Alternatively, the transistors may beformed in different processes.

Structure Example 2

FIGS. 19A and 19B are perspective views of a touch panel 505A. Note thatFIGS. 19A and 19B illustrate only main components for simplicity. FIG.20A is a cross-sectional view taken along the dashed-dotted line G-H inFIG. 19A.

As illustrated in FIGS. 19A and 19B, the touch panel 505A includes adisplay portion 501, the scan line driver circuit 303 g(1), a touchsensor 595, and the like. Furthermore, the touch panel 505A includes thesubstrate 701, the substrate 711, and a substrate 590.

The touch panel 505A includes a plurality of pixels and a plurality ofwirings 311. The plurality of wirings 311 can supply signals to thepixels. The plurality of wirings 311 are led to a peripheral portion ofthe substrate 701, and part of the plurality of wirings 311 form theterminal 319. The terminal 319 is electrically connected to an FPC509(1).

The touch panel 505A includes the touch sensor 595 and a plurality ofwirings 598. The plurality of wirings 598 are electrically connected tothe touch sensor 595. The plurality of wirings 598 are led to aperipheral portion of the substrate 590, and part of the plurality ofwirings 598 form a terminal. The terminal is electrically connected toan FPC 509(2). Note that in FIG. 19B, electrodes, wirings, and the likeof the touch sensor 595 provided on the back side of the substrate 590(the side facing the substrate 701) are indicated by solid lines forclarity.

As the touch sensor 595, for example, a capacitive touch sensor can beused. Examples of the capacitive touch sensor include a surfacecapacitive touch sensor and a projected capacitive touch sensor. Anexample of using a projected capacitive touch sensor is described here.

Examples of the projected capacitive touch sensor include a selfcapacitive touch sensor and a mutual capacitive touch sensor, whichdiffer mainly in the driving method. The use of a mutual capacitive typeis preferred because multiple points can be sensed simultaneously.

Note that a variety of sensors that can sense the closeness or thecontact of a sensing target such as a finger can be used as the touchsensor 595.

The projected capacitive touch sensor 595 includes electrodes 591 andelectrodes 592. The electrodes 591 are electrically connected to any ofthe plurality of wirings 598, and the electrodes 592 are electricallyconnected to any of the other wirings 598.

The electrodes 592 each have a shape of a plurality of quadranglesarranged in one direction with one corner of a quadrangle connected toone corner of another quadrangle as illustrated in FIGS. 19A and 19B.

The electrodes 591 each have a quadrangular shape and are arranged in adirection intersecting with the direction in which the electrodes 592extend. Note that the plurality of electrodes 591 is not necessarilyarranged in the direction orthogonal to one electrode 592 and may bearranged to intersect with one electrode 592 at an angle of less than 90degrees.

The wiring 594 intersects with the electrode 592. The wiring 594electrically connects two electrodes 591 between which the electrode 592is positioned. The intersecting area of the electrode 592 and the wiring594 is preferably as small as possible. Such a structure allows areduction in the area of a region where the electrodes are not provided,reducing unevenness in transmittance. As a result, unevenness inluminance of light from the touch sensor 595 can be reduced.

Note that the shapes of the electrodes 591 and the electrodes 592 arenot limited to the above-mentioned shapes and can be any of a variety ofshapes. For example, the plurality of electrodes 591 may be provided sothat space between the electrodes 591 are reduced as much as possible,and a plurality of electrodes 592 may be provided with an insulatinglayer sandwiched between the electrodes 591 and the electrodes 592 andmay be spaced apart from each other to form a region not overlappingwith the electrodes 591. In that case, between two adjacent electrodes592, it is preferable to provide a dummy electrode which is electricallyinsulated from these electrodes, whereby the area of a region having adifferent transmittance can be reduced.

Note that a more specific structure example of the touch sensor 595 willbe described later.

As illustrated in FIG. 20A, the touch panel 505A includes the substrate701, the adhesive layer 703, the insulating layer 705, the substrate711, the adhesive layer 713, and the insulating layer 715. Thesubstrates 701 and 711 are bonded to each other with the adhesive layer360.

An adhesive layer 597 bonds the substrate 590 to the substrate 711 sothat the touch sensor 595 overlaps with the display portion 501. Theadhesive layer 597 transmits light.

The electrodes 591 and the electrodes 592 are formed using a conductivematerial that transmits light. As a light-transmitting conductivematerial, a conductive oxide such as indium oxide, indium tin oxide,indium zinc oxide, zinc oxide, or zinc oxide to which gallium is addedcan be used. Note that a film including graphene may be used as well.The film including graphene can be formed, for example, by reducing afilm including graphene oxide. As a reducing method, a method withapplication of heat or the like can be employed.

The resistance of a material used for conductive films such as theelectrodes 591, the electrodes 592, and the wiring 594, i.e., a wiringand an electrode in the touch panel, is preferably low. Examples of thematerial include ITO, indium zinc oxide, ZnO, silver, copper, aluminum,a carbon nanotube, and graphene. Alternatively, a metal nanowireincluding a number of conductors with an extremely small width (forexample, a diameter of several nanometers) may be used. Note that ametal nanowire, a carbon nanotube, graphene, or the like may be used foran electrode of the display element, e.g., a pixel electrode or a commonelectrode because of its high transmittance.

The electrodes 591 and the electrodes 592 may be formed by depositing alight-transmitting conductive material on the substrate 590 by asputtering method and then removing an unnecessary portion by a varietyof patterning technique such as photolithography.

The electrodes 591 and the electrodes 592 are covered with an insulatinglayer 593. Furthermore, openings reaching the electrodes 591 are formedin the insulating layer 593, and the wiring 594 electrically connectsthe adjacent electrodes 591. A light-transmitting conductive materialcan be favorably used as the wiring 594 because the aperture ratio ofthe touch panel can be increased. Moreover, a material with higherconductivity than the conductivities of the electrodes 591 and theelectrodes 592 can be favorably used for the wiring 594 because electricresistance can be reduced.

Note that an insulating layer covering the insulating layer 593 and thewiring 594 may be provided to protect the touch sensor 595.

Furthermore, a connection layer 599 electrically connects the wirings598 to the FPC 509(2).

The display portion 501 includes a plurality of pixels arranged in amatrix. Each pixel has the same structure as Structure Example 1; thus,description is omitted.

Any of various kinds of transistors can be used in the touch panel. Astructure in the case of using bottom-gate transistors is illustrated inFIGS. 20A and 20B.

For example, a semiconductor layer containing an oxide semiconductor,amorphous silicon, or the like can be used in the transistor 302 t andthe transistor 303 t illustrated in FIG. 20A.

For example, a semiconductor layer containing polycrystalline siliconthat is obtained by crystallization process such as laser annealing canbe used in the transistor 302 t and the transistor 303 t illustrated inFIG. 20B.

A structure in the case of using top-gate transistors is illustrated inFIG. 20C.

For example, a semiconductor layer including polycrystalline silicon, asingle crystal silicon film that is transferred from a single crystalsilicon substrate, or the like can be used in the transistor 302 t andthe transistor 303 t illustrated in FIG. 20C.

Structure Example 3

FIGS. 21A to 21C are cross-sectional views of a touch panel 505B. Thetouch panel 505B described in this embodiment is different from thetouch panel 505A in Structure Example 2 in that received image data isdisplayed on the side where the transistors are provided, that the touchsensor is provided on the substrate 701 side of the display portion, andthat the FPC 509(2) is provided on the same side as the FPC 509(1).Different structures will be described in detail below, and the abovedescription is referred to for the other similar structures.

The coloring layer 367R is positioned in a region overlapping with thelight-emitting element 350R. The light-emitting element 350R illustratedin FIG. 21A emits light to the side where the transistor 302 t isprovided. Accordingly, part of light emitted from the light-emittingelement 350R passes through the coloring layer 367R and is emitted tothe outside of the light-emitting module 380R as indicated by an arrowin FIG. 21A.

The touch panel 505B includes the light-blocking layer 367BM on thelight extraction side. The light-blocking layer 367BM is provided so asto surround the coloring layer (e.g., the coloring layer 367R).

The touch sensor 595 is provided not on the substrate 711 side but onthe substrate 701 side (see FIG. 21A).

The adhesive layer 597 bonds the substrate 590 to the substrate 701 sothat the touch sensor 595 overlaps with the display portion. Theadhesive layer 597 transmits light.

Note that a structure in the case of using bottom-gate transistors inthe display portion 501 is illustrated in FIGS. 21A and 21B.

For example, a semiconductor layer containing an oxide semiconductor,amorphous silicon, or the like can be used in the transistor 302 t andthe transistor 303 t illustrated in FIG. 21A.

For example, a semiconductor layer containing polycrystalline siliconcan be used in the transistor 302 t and the transistor 303 t illustratedin FIG. 21B.

A structure in the case of using top-gate transistors is illustrated inFIG. 21C.

For example, a semiconductor layer containing polycrystalline silicon, asingle crystal silicon film that is transferred, or the like can be usedin the transistor 302 t and the transistor 303 t illustrated in FIG.21C.

Structural Example of Touch Sensor

A more specific structure example of the touch sensor 595 is describedbelow with reference to drawings.

FIG. 22A is a schematic top view of the touch sensor 595. The touchsensor 595 includes a plurality of electrodes 531, a plurality ofelectrodes 532, a plurality of wirings 541, and a plurality of wirings542 over a substrate 590. The substrate 590 is provided with an FPC 550which is electrically connected to each of the plurality of wirings 541and the plurality of wirings 542.

FIG. 22B shows an enlarged view of a region surrounded by a dasheddotted line in FIG. 22A. The electrodes 531 are each in the form of aseries of rhombic electrode patterns aligned in a lateral direction ofthis figure. The rhombic electrode patterns aligned in a line areelectrically connected to each other. The electrodes 532 are also eachin the form of a series of rhombic electrode patterns aligned in alongitudinal direction in this figure and the rhombic electrode patternsaligned in a line are electrically connected. Part of the electrode 531and part of the electrode 532 overlap and intersect with each other. Atthis intersection portion, an insulator is sandwiched in order to avoidan electrical short-circuit between the electrode 531 and the electrode532.

As shown in FIG. 22C, the electrodes 532 may form a plurality ofisland-shape rhombic electrodes 533 and bridge electrodes 534. Theplurality of island-shape rhombic electrodes 533 are aligned in alongitudinal direction in this figure, and two adjacent electrodes 533are electrically connected to each other by the bridge electrode 534.Such a structure makes it possible that the electrodes 533 and theelectrodes 531 can be formed at the same time by processing the sameconductive film. This can prevent variations in the thickness of thesefilms, and can prevent the resistance value and the light transmittanceof each electrode from varying from place to place. Note that althoughthe electrodes 532 include the bridge electrodes 534 here, theelectrodes 531 may have such a structure.

As shown in FIG. 22D, a design in which rhombic electrode patterns ofthe electrodes 531 and 532 shown in FIG. 22B are hollowed out and onlyedge portions are left may be used. At that time, when the electrodes531 and the electrodes 532 are too small in width for the users to see,the electrodes 531 and the electrodes 532 can be formed using alight-blocking material such as a metal or an alloy, as described later.In addition, either the electrodes 531 or the electrodes 532 shown inFIG. 22D may include the above bridge electrodes 534.

One of the electrodes 531 is electrically connected to one of thewirings 541. One of the electrodes 532 is electrically connected to oneof the wirings 542.

When a touch panel is formed in such a manner that the touch sensor 595is stacked over a display surface of the display panel, alight-transmitting conductive material is preferably used for theelectrodes 531 and the electrodes 532. In the case where alight-transmitting conductive material is used for the electrodes 531and the electrodes 532 and light from the display panel is extractedthrough the electrodes 531 or the electrodes 532, it is preferable thata conductive film containing the same conductive material be arrangedbetween the electrodes 531 and the electrodes 532 as a dummy pattern.Part of a space between the electrodes 531 and the electrodes 532 isfilled with the dummy pattern, which can reduce variation in lighttransmittance. As a result, unevenness in luminance of light transmittedthrough the touch sensor 595 can be reduced.

As a light-transmitting conductive material, a conductive oxide such asindium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zincoxide to which gallium is added can be used. Note that a film includinggraphene can be used as well. The film including graphene can be formed,for example, by reducing a film containing graphene oxide. As a reducingmethod, a method with application of heat or the like can be employed.

Further, a metal film or an alloy film which is thin enough to have alight-transmitting property can be used. For example, a metal materialsuch as gold, silver, platinum, magnesium, nickel, tungsten, chromium,molybdenum, iron, cobalt, copper, palladium, or titanium, or an alloymaterial containing any of these metal materials can be used.Alternatively, a nitride of the metal material or the alloy material(e.g., titanium nitride), or the like may be used. Alternatively, astacked film in which two or more of conductive films containing theabove materials are stacked may be used.

For the electrodes 531 and the electrodes 532, a conductive film whichis processed to be too thin to see by the users may be used. Such aconductive film is processed into a lattice shape (a mesh shape), forexample, which makes it possible to achieve high conductivity and highvisibility of the display device. It is preferable that the conductivefilm have a portion in which the width is greater than or equal to 30 nmand less than or equal to 100 μm, preferably greater than or equal to 50nm and less than or equal to 50 μm, and further preferably greater thanor equal to 50 nm and less than or equal to 20 μm. In particular, theconductive film having the pattern width of 10 μm or less is extremelydifficult to see by the users, which is preferable.

As examples, enlarged schematic views of part of the electrodes 531 orthe electrodes 532 (part in a circle formed by a dashed-dotted line inFIG. 22B) are shown in FIGS. 23A to 23D. FIG. 23A shows an example ofthe case in which a lattice-shape conductive film 561 is used. Thelattice-shape conductive film 561 is preferably placed so as not tooverlap the display element included in the display device because lightfrom the display device is not blocked. In that case, it is preferablethat the direction of the lattice be provided so as to be the same asthe direction of the display element arrangement and that the pitch ofthe lattice be an integer multiple of the pitch of the display elementarrangement.

FIG. 23B shows an example of a lattice-shape conductive film 562, whichis processed so as to be provided with triangle openings. Such astructure makes it possible to further reduce the resistance comparedwith the structure shown in FIG. 23A.

In addition, a conductive film 563, which has an irregular patternshape, may be used as shown in FIG. 23C. Such a structure can preventgeneration of moiré when overlapping with the display portion of thedisplay device. Note that “moiré” refers to a fringe pattern created bydiffraction or interference when external light or the like passesthrough or external light is reflected by narrow conductive films or thelike spaced uniformly.

Conductive nanowires may be used for the electrodes 531 and theelectrodes 532. FIG. 23D shows an example of the case in which nanowires564 are used. The nanowires 564 are dispersed at appropriate density soas to be in contact with the adjacent nanowires, which can form atwo-dimensional network; therefore, a conductive film with extremelyhigh light-transmitting property can be provided. For example, ananowire which has a mean value of the diameters of greater than orequal to 1 nm and less than or equal to 100 nm, preferably greater thanor equal to 5 nm and less than or equal to 50 nm, further preferablygreater than or equal to 5 nm and less than or equal to 25 nm can beused. As the nanowire 564, a metal nanowire such as an Ag nanowire, a Cunanowire, and an Al nanowire, a carbon nanotube, or the like can beused. In the case of using an Ag nanowire, for example, lighttransmittance of 89% or more and a sheet resistance of 40 ohm/square ormore and 100 ohm/square or less can be achieved.

Although examples in which a plurality of rhombuses are aligned in onedirection are shown in FIG. 22A and the like as top surface shapes ofthe electrodes 531 and the electrodes 532, the shapes of the electrodes531 and the electrodes 532 are not limited thereto and can have varioustop surface shapes such as a belt shape (a rectangular shape), a beltshape having a curve, and a zigzag shape. In addition, although theabove shows the electrodes 531 and the electrodes 532 are arranged to beperpendicular to each other, they are not necessarily arranged to beperpendicular and the angle formed by two of the electrodes may be lessthan 90°.

FIGS. 24A to 24C illustrate examples of the case where electrodes 536and electrodes 537, which have a top surface shape of thin lines, areused instead of the electrodes 531 and the electrodes 532. FIG. 24Ashows an example in which linear electrodes 536 and 537 are arranged soas to form a lattice shape.

FIG. 24B shows an example in which the electrodes 536 and the electrodes537 have a top surface shape of a zigzag shape. As shown in FIG. 24B,the electrodes 536 and the electrodes 537 are arranged so as not tocross the straight-line portions at the centers but so as to place thecenters of the straight-line portions in different positions from eachother; therefore, the length of closely facing parallel parts of theelectrodes 536 and the electrodes 537 can be longer. This is preferablebecause the capacitance between the electrodes can be increased and thesensitivity can be increased. Alternatively, as shown in FIG. 24C, theelectrodes 536 and the electrodes 537 are arranged so as to have adesign in which part of the straight-line portion of a zigzag shape isprojected, which can increase the capacitance between the electrodesbecause the length of the parts facing each other can be longer evenwhen the centers of the straight-line portions are placed in the sameposition.

FIGS. 25A to 25C show enlarged views of a region surrounded by a dasheddotted line in FIG. 24B, and FIGS. 25D to 25F show enlarged views of aregion surrounded by a dashed dotted line in FIG. 24C. In thesedrawings, the electrodes 536, the electrodes 537, and intersectionportions 538 at which the electrodes 536 and the electrodes 537intersect are illustrated. The straight-line portions of the electrodes536 and the electrodes 537 shown in FIGS. 25A and 25D may have aserpentine shape that meanders with angled corners as shown in FIGS. 25Band 25E or may have a serpentine shape that continuously meanders asshown in FIGS. 25C and 25F.

Structure Example 4

As illustrated in FIG. 26, a touch panel 500TP includes a displayportion 500 and an input portion 600 that overlap each other. FIG. 27 isa cross-sectional view taken along the dashed-dotted line Z1-Z2 in FIG.26.

Individual components included in the touch panel 500TP are describedbelow. Note that these components cannot be clearly distinguished andone component also serves as another component or include part ofanother component in some cases. Note that the touch panel 500TP inwhich the input portion 600 overlaps with the display portion 500 isalso referred to as a touch panel.

The input portion 600 includes a plurality of sensing units 602 arrangedin a matrix. The input portion 600 also includes a selection signal lineGL, a control line RES, a signal line DL, and the like.

The selection signal line GL and the control line RES are electricallyconnected to the plurality of sensing units 602 that are arranged in therow direction (indicated by the arrow R in FIG. 26). The signal line DLis electrically connected to the plurality of sensing units 602 that arearranged in the column direction (indicated by the arrow C in FIG. 26).

The sensing unit 602 senses an object that is close thereto or incontact therewith and supplies a sensing signal. For example, thesensing unit 602 senses, for example, capacitance, illuminance, magneticforce, electric waves, or pressure and supplies data based on the sensedphysical quantity. Specifically, a capacitor, a photoelectric conversionelement, a magnetic sensing element, a piezoelectric element, aresonator, or the like can be used as the sensing element.

The sensing unit 602 senses, for example, a change in capacitancebetween the sensing unit 602 and an object close thereto or an object incontact therewith.

Note that when an object having a dielectric constant higher than thatof the air, such as a finger, comes close to a conductive film in theair, the capacitance between the finger and the conductive film changes.The sensing unit 602 can sense the capacitance change and supply sensingdata.

For example, distribution of charge occurs between the conductive filmand the capacitor owing to the change in the electrostatic capacitance,so that the voltage across the capacitor is changed. This voltage changecan be used as the sensing signal.

The sensing unit 602 is provided with a sensor circuit. The sensorcircuit is electrically connected to the selection signal line GL, thecontrol line RES, the signal line DL, or the like.

The sensor circuit includes a transistor, a sensor element, and/or thelike. For example, a conductive film and a capacitor electricallyconnected to the conductive film can be used for the sensor circuit. Acapacitor and a transistor electrically connected to the capacitor canalso be used for the sensor circuit.

For example, a capacitor 650 including an insulating layer 653, and afirst electrode 651 and a second electrode 652 between which theinsulating layer 653 is provided can be used for the sensor circuit (seeFIG. 27). Specifically, the voltage between the electrodes of thecapacitor 650 changes when an object approaches the conductive filmwhich is electrically connected to one electrode of the capacitor 650.

The sensing unit 602 includes a switch that can be turned on or off inaccordance with a control signal. For example, a transistor M12 can beused as the switch.

A transistor which amplifies a sensing signal can be used in the sensingunit 602.

Transistors manufactured through the same process can be used as thetransistor that amplifies a sensing signal and the switch. This allowsthe input portion 600 to be provided through a simplified process.

The sensing unit 602 includes a plurality of window portions 667arranged in a matrix. The window portions 667 transmit visible light. Alight-blocking layer BM may be provided between the window portions 667.

A coloring layer is provided in a position overlapping with the windowportion 667 in the touch panel 500TP. The coloring layer transmits lightof a predetermined color. Note that the coloring layer can be referredto as a color filter. For example, a coloring layer 367B transmittingblue light, a coloring layer 367G transmitting green light, and acoloring layer 367R transmitting red light can be used. Alternatively, acoloring layer transmitting yellow light or white light may be used.

The display portion 500 includes the plurality of pixels 302 arranged ina matrix. The pixel 302 is positioned so as to overlap with the windowportions 667 of the input portion 600. The pixels 302 may be arranged athigher resolution than the sensing units 602. Each pixel has the samestructure as Structure Example 1; thus, description is omitted.

The touch panel 500TP includes the input portion 600 that includes theplurality of sensing units 602 arranged in a matrix and the windowportions 667 transmitting visible light, the display portion 500 thatincludes the plurality of pixels 302 overlapping with the windowportions 667, and the coloring layers between the window portions 667and the pixels 302. Each of the sensing units includes a switch that canreduce interference in another sensing unit.

Thus, sensing data obtained by each sensor unit can be supplied togetherwith the positional information of the sensor unit. In addition, sensingdata can be supplied in relation to the positional data of the pixel fordisplaying an image. In addition, the sensor unit which does not supplythe sensing data is not electrically connected to a signal line, wherebyinterference with the sensor unit which supplies a sensing signal can bereduced. Consequently, the novel touch panel 500TP that is highlyconvenient or highly reliable can be provided.

For example, the input portion 600 of the touch panel 500TP can sensesensing data and supply the sensing data together with the positionaldata. Specifically, a user of the touch panel 500TP can make a varietyof gestures (e.g., tap, drag, swipe, and pinch-in operation) using, as apointer, his/her finger or the like on the input portion 600.

The input portion 600 can sense a finger or the like that comes close toor is in contact with the input portion 600 and supply sensing dataincluding a sensed position, path, or the like.

An arithmetic unit determines whether or not supplied data satisfies apredetermined condition on the basis of a program or the like andexecutes an instruction associated with a predetermined gesture.

Thus, a user of the input portion 600 can make the predetermined gesturewith his/her finger or the like and make the arithmetic unit execute aninstruction associated with the predetermined gesture.

For example, first, the input portion 600 of the touch panel 500TPselects one sensing unit X from the plurality of sensing units that cansupply sensing data to one signal line. Then, electrical continuitybetween the signal line and the sensing units other than the sensingunit X is not established. This can reduce interference of the othersensing units in the sensing unit X.

Specifically, interference of sensing elements of the other sensingunits in a sensing element of the sensing unit X can be reduced.

For example, in the case where a capacitor and a conductive film towhich one electrode of the capacitor is electrically connected are usedfor the sensing element, interference of the potentials of theconductive films of the other sensing units in the potential of theconductive film of the sensing unit X can be reduced.

Thus, the touch panel 500TP can drive the sensing unit and supplysensing data independently of its size. The touch panel 500TP can have avariety of sizes, for example, ranging from a size for a hand-helddevice to a size for an electronic blackboard.

The touch panel 500TP can be folded and unfolded. Even in the case whereinterference of the other sensing units in the sensing unit X isdifferent between the folded state and the unfolded state, the sensingunit can be driven and sensing data can be supplied without dependenceon the state of the touch panel 500TP.

The display portion 500 of the touch panel 500TP can be supplied withdisplay data. For example, an arithmetic unit can supply the displaydata.

In addition to the above structure, the touch panel 500TP can have thefollowing structure.

The touch panel 500TP may include a driver circuit 603 g or a drivercircuit 603 d. In addition, the touch panel 500TP may be electricallyconnected to an FPC1.

The driver circuit 603 g can supply selection signals at predeterminedtimings, for example. Specifically, the driver circuit 603 g suppliesselection signals to the selection signal lines GL row by row in apredetermined order. Any of a variety of circuits can be used as thedriver circuit 603 g. For example, a shift register, a flip flopcircuit, a combination circuit, or the like can be used.

The driver circuit 603 d supplies sensing data on the basis of a sensingsignal supplied from the sensing unit. Any of a variety of circuits canbe used as the driver circuit 603 d. For example, a circuit that canform a source follower circuit or a current mirror circuit by beingelectrically connected to the sensing circuit in the sensing unit can beused as the driver circuit 603 d. In addition, an analog-to-digitalconverter circuit that converts a sensing signal into a digital signalmay be provided in the driver circuit 603 d.

The FPC1 supplies a timing signal, a power supply potential, or the likeand is supplied with a sensing signal.

The touch panel 500TP may include a driver circuit 503 g, a drivercircuit 503 s, a wiring 311, and a terminal 319. In addition, the touchpanel 500TP may be electrically connected to an FPC2.

In addition, a protective layer 670 that prevents damage and protectsthe touch panel 500TP may be provided. For example, a ceramic coat layeror a hard coat layer can be used as the protective layer 670.Specifically, a layer containing aluminum oxide or a UV curable resincan be used.

In the case of a transflective liquid crystal display or a reflectiveliquid crystal display, some of or all of pixel electrodes function asreflective electrodes. For example, some or all of pixel electrodes areformed to contain aluminum, silver, or the like.

Furthermore, a memory circuit such as an SRAM can be provided under thereflective electrodes, leading to lower power consumption. A structuresuitable for employed display elements can be selected from among avariety of structures of pixel circuits.

The touch panel described in this embodiment can be used instead of thedisplay panel 100 included in the display device 10 in Embodiment 1. Inthis case, a touch panel with a structure in which a plurality of FPCsconnected to the touch panel are extracted from the same side, such asthe touch panel 390 and the touch panel 505B, can be preferably used.Note that in the case where a touch panel is used instead of the displaypanel 100, the display device 10 can be referred to as an input/outputdevice.

The adhesive layer 107 that bonds the plurality of touch panels to thesubstrate 106 is preferably provided so that the top surfaces of thetouch sensors 595 (or the input portions 600) of these touch panels arelevel with each other and the top surfaces are parallel to the substrate106. The distances between the surface of the input/output device (i.e.,the surface of the substrate 106) and the touch sensors 595 (or theinput portions 600) of the touch panels are made the same, wherebylocation dependence (also called in-plane variation) of detectionsensitivity can be reduced.

This embodiment can be combined with any other embodiment asappropriate.

EXAMPLE

In this example, an example in which a display device of one embodimentof the present invention was manufactured is described.

The display device 20 includes four display panels 80 arranged in amatrix of two rows and two columns (two display panels in the horizontaldirection and two display panels in the longitudinal direction). Table 1shows the specifications of the display panel 80 in this example. FIG.28A is a photograph of the display panel 80 displaying an image.

TABLE 1 Specifications Panel Size 13.5 inches Driving Method Activematrix Resolution 1280 (H) × 720 (V) HD Pixel Density 108 ppi ApertureRatio 61.0% Coloring Method White tandem OLED, Top emission, Colorfilter (WTC technique) Pixel Arrangement RGBY checker Source DriverCOF + DeMUX Scan Driver Integrated Thickness Lower than or equal to 100μm at transparent bezel

FIG. 29 is a photograph of the display device 20 displaying an image.The horizontal direction in FIG. 29 corresponds to the X-axis directionin FIG. 1A and FIG. 4A, and the longitudinal direction in FIG. 29corresponds to the Y-axis direction in FIG. 1A and FIG. 4A. The displaydevice 20 includes four plates 90, four stages 91, four driver circuits62, four adjusting units 63, and the frame 21.

FIGS. 30A and 30B are photographs of one of four component groups 60 inthe display device 20. In each component group 60, the display panel 80and the plate 90 are fixed to each other and connected to the stage 91.FIG. 30A is a photograph of the component group 60 from the diagonallyfront side. The display portion 41 of the display panel 80 is shown inFIG. 30A. FIG. 30B is a photograph of the component group 60 from thediagonally rear side.

As shown in FIG. 30A, the display panel 80 includes the transparentportion 82 in a position adjacent to two sides of the display portion41. As shown in FIG. 30B, the display panel 80 is fixed to the plate 90so that transparent portion 82 and a part of the display portion 41extend beyond two sides of the plate 90. In the display device 20 havingsuch a structure, display portions 41 of the four display panels 80 canbe arranged seamlessly, and an image or video without unnatural seamscan be displayed on a display portion 11C used as one display area (seeFIG. 29). In this example, the width of the transparent portion 82 isapproximately 2 mm (see FIG. 28B). FIG. 28B is an enlarged photograph ofa region surrounded by a dashed line in FIG. 28A.

As shown in FIG. 30B, the alignment of the plate 90 and the stage 91 inthe horizontal direction and the longitudinal direction can be performedprecisely using the depression 51, the fastening 52, and the guide 53 ofthe plate 90. In the display device 20, the stage 91 is fixed to theframe 21 through the adjusting unit 63. As the adjusting unit 63, thecombination of the X-axis stage, the Y-axis stage, and the goniometerstage is used as described in Embodiment 1. In the display device 20having such a structure, the positions of the display panels 80 can beadjusted with high precision so that the display portions 41 of the fourdisplay panels 80 are seamlessly arranged to be parallel and that thepositional shift of display on the display portions 41 of the adjacentdisplay panels 80 does not occur. FIG. 31A is an enlarged photograph ofa region in the vicinity of the joint portion of the display portions inthe display device 20 displaying an image. In FIG. 31A, the jointportion of the display portions 41 is included in a region surrounded bya dashed line. It is shown from FIG. 31A that the display portions 41 ofthe four display panels 80 in the display device 20 are arranged so thatthe positional shift of display does not occur along the joint portion.

Note that the first surface of the plate 90 may be provided with afixing instrument. In the case where the display panel 80 includes achip on film (COF), the COF can be fixed to the first surface of theplate 90 using the fixing instrument. FIG. 34 is a photograph of theplate 90 in which the fixing instrument 54 is provided in the vicinityof the convexly curved surface of the first surface and the displaypanel 80 fixed to the plate 90. The fixing instrument 54 includes amember 54 a and a member 54 b. A material of the member 54 a is notparticularly limited. The member 54 b is preferably formed of aninsulator. The member 54 a is formed of a material similar to that ofthe plate 90. The member 54 b is formed of plastic. By fixing the COF ofthe display device 20 to the member 54 b with a screw or the like, thedisplay panel 80 can be prevented from being broken when the plate 90 towhich the display panel 80 is fixed is carried.

The driver circuits 62 can correct variation in display performance ofthe display panels 80 because of having a function of adjusting colortone, luminance, or the like of display of the display panels 80. Thus,the display portion 11C of the display device 20 can perform displaywith high display quality in which variation in color tone, luminance,or the like is suppressed.

FIG. 31B is a photograph of the display device 20 from the diagonallyfront side with respect to the display portion 11C. As shown in FIG.31B, the first portion 44 of the display panel 80 is bent to the rearsurface side of the display surface of the display panel 80 along theconvexly curved surface of the plate 50. Thus, the driver circuit 62provided on the rear surface side of the display panel 80 can be easilyconnected to the external electrode 46. In addition, the externalelectrode 46 or the like does not hinder overlapping of the displaypanels 80, so that the display surface of the display portion 11C can bemade almost flat with few steps. Note that in FIG. 31B, the lower (rear)display panel is denoted by 80 a, whereas the upper (front) displaypanel is denoted by 80 b.

In the display device 20, the display portion 11C has a size of 27inches diagonal (the size of the display portion 41 of one display panel80 is 13.5 inches diagonal), 2560×1440 effective pixels, the pixel sizeof 234 μm×234 μm, a resolution of 108 ppi, and an aperture ratio of61.0%. A built-in scan driver and an external source driver attached bychip on film (COF) were used.

FIG. 32 is a photograph of the display device 10 displaying an image.The display device 10 includes display panels 80 of this examplearranged in a matrix of six rows and six columns (six display panels ineach of the horizontal direction and the longitudinal direction). FIG.33A is a photograph of the rear side of the display surface of thedisplay device 10. FIG. 33B is an enlarged photograph of a portionsurrounded by a dotted line in FIG. 33A. FIG. 33B is a photographshowing a state in which the cables 64 connected to the driver circuits62 in FIG. 33A are removed.

The display device 10 includes 36 plates 90, 36 stages 91, 36 drivercircuits 62, 36 adjusting units 63, and the frame 21. The display device10 also includes four video signal dividers 22 and two video outputunits 23 (not shown). In this example, an uncompressed disk recorder isused as the video output unit 23. Note that in the display device 10, adisplay portion 11D has a size of 81 inches diagonal and the number ofeffective pixels is 7680×4320 (8K).

In this example, as the light-emitting element included in the displayportion 41, a tandem (stack) organic EL element emitting white light wasused. The light-emitting element has a top emission structure. Lightfrom the light-emitting element is extracted outside through a colorfilter.

As the transistor, a transistor including a c-axis aligned crystallineoxide semiconductor (CAAC-OS) was used. Unlike amorphous semiconductor,the CAAC-OS has few defect states, so that the reliability of thetransistor can be improved. In addition, because laser crystallizationis not needed for formation of a CAAC-OS, a uniform film can be formedeven over a large-sized glass substrate or the like. Moreover, since theCAAC-OS does not have a grain boundary, stress that is caused by bendinga flexible display panel does not easily make a crack in a CAAC-OS film.

A CAAC-OS is an oxide semiconductor having c-axis alignment in adirection substantially perpendicular to the film surface. It has beenfound that oxide semiconductors have a variety of crystal structuresother than a single-crystal structure. An example of such structures isa nano-crystal (nc) structure, which is an aggregate of nanoscalemicrocrystals. The crystallinity of a CAAC-OS structure is lower thanthat of a single-crystal structure and higher than that of an ncstructure.

In this example, a channel-etched transistor including an In—Ga—Zn-basedoxide was used. The transistor was fabricated over a glass substrate ata process temperature lower than 500° C.

As shown in FIG. 29 and FIG. 32, in one embodiment of the presentinvention, a large-sized display device in which a joint portion ofdisplay portions is hardly recognized by a user was able to be obtained.

At least part of this example can be implemented in combination with anyof the embodiments described in this specification as appropriate.

REFERENCE NUMERALS

10: display device, 11A: display portion, 11B: display portion, 11C:display portion, 11D: display portion, 20: display device, 20A: displaydevice, 20B: display device, 21: frame, 21A: frame, 21B: frame, 22:video signal divider, 23: video output unit, 30: display panel, 30 a:display panel, 30 b: display panel, 31: pixel, 31 a: pixel, 31 b: pixel,32: transparent portion, 32 b: transparent portion, 33 c: operatingcircuit, 33 d: operating circuit, 34 c: wiring, 34 d: wiring, 35:wiring, 36: substrate, 37: substrate, 38: adhesive layer, 40: displaypanel, 40 a: display panel, 40 b: display panel, 41: display portion, 41a: display portion, 41 b: display portion, 42: transparent portion, 42b: transparent portion, 43: operating circuit portion, 43 a: operatingcircuit portion, 44: first portion, 44 a: first portion, 44 b: firstportion, 45: terminal, 45 b: terminal, 46: external electrode, 46 a:external electrode, 46 b: external electrode, 50: plate, 50 a: plate, 50b: plate, 52: fastening, 52 a: fastening, 53: guide, 53 a: guide, 54:fixing instrument, 54 a: member, 54 b: member, 60: component group, 61:stage, 61 a: stage, 61 b: stage, 62: driver circuit, 62 a: drivercircuit, 62 b: driver circuit, 63: adjusting unit, 63 a: adjusting unit,63 b: adjusting unit, 64: cable, 64 a: cable, 64 b: cable, 65: cable,80: display panel, 80 a: display panel, 80 b: display panel, 82:transparent portion, 82 b: transparent portion, 90: plate, 90 a: plate,90 b: plate, 91: stage, 91 a: stage, 91 b: stage, 100: display panel,106: substrate, 107: adhesive layer, 301: display portion, 302: pixel,302B: sub-pixel, 302G: sub-pixel, 302R: sub-pixel, 302 t: transistor,303 c: capacitor, 303 g(1): scan line driver circuit, 303 g(2): imagingpixel driver circuit, 303 s(1): image signal line driver circuit, 303s(2): imaging signal line driver circuit, 303 t: transistor, 304: gate,308: imaging pixel, 308 p: photoelectric conversion element, 308 t:transistor, 309: FPC, 311: wiring, 319: terminal, 321: insulating layer,328: partition, 329: spacer, 350R: light-emitting element, 351R: lowerelectrode, 352: upper electrode, 353: EL layer, 353 a: EL layer, 353 b:EL layer, 354:

intermediate layer, 360: adhesive layer, 367B: coloring layer, 367BM:light-blocking layer, 367G: coloring layer, 367 p: anti-reflectivelayer, 367R: coloring layer, 380B: light-emitting module, 380G:light-emitting module, 380R: light-emitting module, 390: touch panel,500: display portion, 500TP: touch panel, 501: display portion, 503 g:driver circuit, 503 s: driver circuit, 505A: touch panel, 505B: touchpanel, 509(1): FPC, 509(2): FPC, 531: electrode, 532: electrode, 533:electrode, 534: bridge electrode, 536: electrode, 537: electrode, 538:intersection portion, 541: wiring, 542: wiring, 550: FPC, 561:conductive film, 562: conductive film, 563: conductive film, 564:nanowire, 590: substrate, 591: electrode, 592: electrode, 593:insulating layer, 594: wiring, 595: touch sensor, 597: adhesive layer,598: wiring, 599: connection layer, 600: input portion, 602: sensingunit, 603 d: driver circuit, 603 g : driver circuit, 650: capacitor,651: electrode, 652: electrode, 653: insulating layer, 667: windowportion, 670: protective layer, 701: substrate, 703: adhesive layer,705: insulating layer, 711: substrate, 713: adhesive layer, 715:insulating layer, 723: adhesive layer, 804: display portion, 806:operating circuit portion, 808: FPC, 810: transparent portion, 815:insulating layer, 816: insulating layer, 817: insulating layer, 817 a:insulating layer, 817 b: insulating layer, 820: transistor, 821:insulating layer, 822: adhesive layer, 823: spacer, 824: transistor,825: connector, 830: light-emitting element, 831: lower electrode, 832:optical adjusting layer, 832B: optical adjusting layer, 832R: opticaladjusting layer, 833: EL layer, 835: upper electrode, 845: coloringlayer, 847: light-blocking layer, 849: overcoat, 856: conductive layer,857: conductive layer, 860: auxiliary electrode, 860 a: conductivelayer, 860 b: conductive layer, 870: transistor, 871: capacitor.

This application is based on Japanese Patent Application serial no.2014-206873 filed with Japan Patent Office on Oct. 8, 2014, JapanesePatent Application serial no. 2014-219086 filed with Japan Patent Officeon Oct. 28, 2014, Japanese Patent Application serial no. 2014-240213filed with Japan Patent Office on Nov. 27, 2014, and Japanese PatentApplication serial no. 2015-043931 filed with Japan Patent Office onMar. 5, 2015, the entire contents of which are hereby incorporated byreference.

1. A display device comprising: a first unit comprising a first displaypanel, a first plate, a first stage, a first driver circuit, and a firstadjusting unit; a second unit comprising a second display panel, asecond plate, a second stage, a second driver circuit, and a secondadjusting unit; and a frame, wherein the first and second drivercircuits are configured to output signals for driving their respectivefirst and second display panels, wherein the first and second adjustingunits are configured to adjust positions and angles of their respectivefirst and second stages and are fixed to the frame, wherein the firstand second plates each comprise a convexly curved surface, wherein thefirst and second display panels cover top surfaces and the convexlycurved surfaces of the first and second plates, respectively, andwherein a part of the first and a part of the second display panelsextend beyond the first and second plates, respectively.